Chip equipment maker ASML said Samsung would invest 779 million euros ($975 million) in its research into next-generation chipmaking technology and in buying a 3 percent equity stake.
ASML has already signed up Intel and TSMC in recent weeks with similar deals to fund and fast-track its research.
ASML has announced an investment program intended attract chip makers and speed up the development of new technology.
Intel said in July it would spend more than $4 billion to buy up to 15 percent of ASML and fund its research. TSMC signed up as well, agreeing to invest 276 million euros in research over the next five years and to pay 838 million euros for a 5 percent equity stake.
Samsung has agreed to similar terms and will invest 276 million euros in research and pay a further 503 million for a 3 percent equity stake in ASML.
ASML wants to move to a new chip-making standard based on bigger wafers, as more chips can be produced if the diameter of the wafers is increased to 450 millimeters from 300 mm, leading to significant cost savings.
The other concerns an advanced chip-making technique known as extreme ultraviolet or EUV lithography, referring to the light source used in the lithography machines to make tinier semiconductors.