Micron Technology today introduced a new class of 1 GHz,
2-gigabit (Gb) and 4 Gb, 30-nanometer (nm) DDR3 devices,
strengthening the company's DDR3 portfolio.
Designed for the high- performance networking and
discrete graphics markets, the new devices feature low
power use while delivering speeds up to 2133
megatransfers per second (MT/s).
Optimized for the discrete graphics and high-speed
networking markets, the new DDR3 devices provide the
latest SoCs/GPUs with bandwidth required for this space.
AMD and LSI are among Micron's technology and IP
partners for these products, both having worked closely
with Micron throughout the development process.
In addition to components that satisfy both the discrete
graphics and networking segments, Micron will offer 2133
megatransfers per second (MT/s) module form factors,
including networking-specific ECC UDIMMs.
Samples of Micron's new class of DDR3 devices are
available now, with volume production ramping by summer.