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Appeared on: Wednesday, May 11, 2011
TSMC Joins SEMATECH to Accelerate Research and Development on 20nm Technologies

TSMC joined SEMATECH as a core member, in an effort to focus on advanced technology development to address some of the industry's most pressing challenges.

TSMC will collaborate with SEMATECH, an international consortium of semiconductor manufacturers, on semiconductor research and development for IC process technologies for 20nm generation and beyond, including extreme ultra-violet (EUV) lithography, 3D interconnects, metrology, novel materials and device structures, and to develop critical infrastructure vital for next-generation manufacturing, including the transition to 450 mm wafer size.

SEMATECH's strong relationships with suppliers, chip makers, universities, and research institutes around the world are a critical element in providing research and development to its members. SEMATECH's other core members include GlobalFoundries, HP, IBM, Intel, Samsung, UMC, and the College of Nanoscale Science and Engineering (CNSE).

SEMATECH manages an international network of collaborative partners, including foundries, IDMs, fabless, packaging and assembly companies, and material and equipment suppliers, to provide solutions to the challenges of chip manufacturing.


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