Samsung has developed the first 32 gigabyte (GB)
dual-inline memory module (LRDIMM), for server
The company will begin mass producing the 32GB LRDIMM in
the second half of this year, giving it the largest family
of DRAM offerings in the industry.
Using 40 nanometer-class, four gigabit (4Gb) DDR3 chips,
which Samsung introduced earlier this year, the new 32GB
LRDIMM accommodates next generation servers designed for
virtualization, cloud computing and other high-capacity
Samsung's 32GB LRDIMM prototype consists of 72 4Gb DDR3
chips and an additional memory buffer chip to help reduce
the load on the memory subsystem by as much as 75 percent.
By using 32GB LRDIMMs, memory capacity can rise up to 384
gigabytes per CPU. In a two-way server system, capacity can
be increased up to 768GB, or about 1.5 times that of a
512GB server system equipped with 32GB DDR3 RDIMMs.
A server equipped with LRDIMMs can process data at 1,333
megabit per second (Mbps), approximately 70 percent faster
than the previous speed of 800 Mbps. Samsung's LRDIMMs
operate at 1.35 or 1.5 volts.