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     This story was printed from CdrInfo.com,

     located at http://www.cdrinfo.com.

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IBM, Chartered Semiconductor Manufacturing Ltd. Samsung Electronics, Co., Ltd., and ARM will develop a 32 nanometer (nm) and 28nm Systems-on-a-Chip (SoCs) design platform based on high-k metal-gate (HKMG) technology from the IBM-led joint-development alliance.

Under this multi-year collaboration, ARM will develop and license a design platform of physical intellectual property (IP) including logic, memory and interface products for the Common Platform technology alliance of IBM, Chartered and Samsung for distribution to their customers.

ARM also announced its intent to develop customized physical IP targeted at achieving optimal power, performance, and area for their current and future Cortex processor family leveraging the attributes of the Common Platform HKMG 32nm/28nm technology. The HKMG technology breaks down the historical barrier of scaling, allowing significant power and performance advantage by utilizing new material science innovations. This technology targets a broad range of embedded segments, including mobile, portable and consumer electronics.

"Through this early engagement, we are creating the foundation for designing power efficient ARM SoCs for customers of the Common Platform," said Warren East, CEO, ARM . "By utilizing the strength of our advanced microprocessors, our leadership in Physical IP design and advanced technology supported by the Common Platform, customers can accelerate the release of products for electronic devices that service a broad range of consumer applications."

The Common Platform partners expect to continue to expand the eco-system in this collaborative initiative to include more members in the near future.