Samsung announced today that it has developed the industry?s first process to enable production of a 16-chip multi-chip package (MCP) of memory.
Samsung?s new 16-chip MCP technology, when applied to 8Gb NAND flash chips, can
enable up to a 16 gigabyte (GB) MCP solution.
Advanced multi-chip package technology requires a combination of key processes
such as wafer thinning technology, redistribution layer technology, chip sawing
technology and wire bonding technology.
To increase the number of chips stacked vertically, the need for further wafer
thinning was a critical design obstacle. For the new 16-chip process, Samsung
introduced wafer-thinning technology that eliminates 24 over 25 (24/25) of the
thickness of each fabricated wafer to reduce the overall thickness to only
30-microns (um). This is just 65 percent the thickness of the 10-chip MCP wafer
(45 um) Samsung developed in 2005 and similar to the size of a human cell, which
measures 20 to 30 microns.
As part of its MCP technology, Samsung also developed a new laser-cutting
technology to cut the wafer into individual chips. This new cutting process
prevents the memory chips from breaking into pieces when they are cut using
conventional blade sawing technology, which was originally designed only for
sawing wafers up to 80 microns thick.
To vertically stack identically-sized dies (chips), a redistribution layer
technology also is applied in Samsung?s new multi-stack MCP process, to enable
wafer fabricators to adhere the wire contacts from just one side, unlike the
conventional method of extending wire connection from both sides of each chip.
Along with a single wire contact per die, the dies are placed in a zigzag stack
to minimize the use of space and the length of the wire connectors. Moreover,
the thickness of the adhesive has been reduced to 20 microns bringing the height
of a 16-die stack to 1.4mm. (A 10-chip MCP uses a 60-micron adhesive layer and
has a total height of 1.6mm.)
Samsung?s new 16-chip MCP was developed just one year after the development of
the first 10-chip MCP. The new 16-chip MCP package technology provides the
highest density solution yet developed for the creation of slimmer consumer