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     This story was printed from CdrInfo.com,

     located at http://www.cdrinfo.com.

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AMD today announced that its Torrenza Initiative is serving as a collaborative force toward achieving future processor socket compatibility in the server industry.

By leveraging the advantages of AMD64 with Direct Connect Architecture and HyperTransport(TM) technology, OEMs will be able to standardize on a Torrenza Innovation Socket for many of their current and future server platforms. This game-changing approach to server design will enable OEMs to consolidate server offerings for multiple processors to potentially a single platform, reducing datacenter disruption and deployment costs for customers. The Torrenza initiative is establishing AMD64 as the Open Innovation Platform.

Leading server OEMs that develop silicon or intend to design products uniquely enabled by the Torrenza Initiative, including Cray, Fujitsu Siemens Computers, HP, IBM, Dell and Sun Microsystems, have endorsed Torrenza as an open innovation initiative, and plan to evaluate the Torrenza Innovation Socket.

The Torrenza Innovation Socket enables OEMs who develop their own silicon to take full advantage of an x86 environment and the accompanying economics associated with packaging, chipsets and motherboard designs. OEMs will be able to contribute to and obtain the Torrenza Innovation Socket Specification and associated design documentation.