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     This story was printed from CdrInfo.com,

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Samsung Electronics said Tuesday it has begun mass production of the world's highest-capacity multi-chip (MCP) package for high-end mobile phones.

With two 1-gigabit NAND flash memory chips and two other dynamic random access memory chips, the new MCP chip has a combined capacity of 2.5 gigabits in a package, the company said in a statement.

The new chip will allow mobile phone users to store about four hours of moving images in their handsets.

Samsung, which is also the world's No. 3 mobile phone maker, said it plans to develop an 8-gigabit MCP chip this year.

Multi-chip package products, popular in high-end mobile phones and other digital devices that require advanced memory capability, are manufactured by combining different types of memory chips in one chip.