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Wednesday, January 10, 2018

AMD has teamed up with high-end server storage technology company Enmotus to bring FuzeDrive for AMD Ryzen, a software that combines your performance SSD with capacity storage into a single fully automated volume.

Thermaltake is demonstrating the Riing Plus RGB Radiator Fan TT Premium Edition Series with Artificial Intelligence (AI) Interactive Voice Control, along with the TT Sync Controller TT Premium Edition at CES 2018.

Samsung confirmed previous reports that its next flagship smartphone (Galaxy S9 and S9+) will be unveiled at the MWC held in February in Barcelona, Spain.

The Spectre microchip security threat was affecting graphic processors as well as CPUs, and Nvidia has release software patches.

The Khronos Group is not just about graphics standards like OpenGL and OpenCL. The consortium group has established Neural Network Exchange Format (NNEF) to help data scientists and engineers easily transfer trained networks.

Chinese BOE exhibited at CES its 8K UHD intelligent interfaces and IoV products together with its partners such as HiSilicon, Byton and StreamTV.

Chinese may finally get their hand on technology for the development of 3D NAND flash chips, with Tsinghua Unigroup to reportedly license the corresponding technology from Intel.

Mushkin is updating its Triactor series of mainstream SATA SSDs with the new Triactor 3DX and 3DL. The company has also on display at its Helix-L cost-effective M.2 NVMe SSD and the Pilot M.2 NVMe drive.

Recording and archiving broadcast content is very popular in Japan and the Blu-ray Disc Association has started licensing the next-gen broadcast recordable Blu-ray format.

Intel announced at CES the first consumer Optane SSD: The 800P.

The Renault-Nissan-Mitsubishi automotive alliance, today announced the launch of Alliance Ventures, a new corporate venture capital fund that plans to invest up to $1 billion to support open innovation over the next five years.

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