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Thursday, July 20, 2017
Movidius, an Intel company, is introducing the Neural Compute Stick, the first USB-based deep learning inference kit and self-contained AI accelerator that delivers dedicated deep neural network processing capabilities to host devices.
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Taiwan Semiconductor Manufacturing Company's (TSMC) integrated fan-out (InFO) wafer-level packaging technology is about to enter its second generation, which is expected to bring more competitiveness to the foundry's 7nm FinFET process technology.
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Samsung Display will reportedly start supplying Xiaomi Technology with 6-inch QHD OLED panels in December for the production of Xiaomi's next-generation flagship smartphones.
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Qualcomm forecast fourth-quarter profit below analysts' estimates as the company's escalating patent battle with Apple continues.
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