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Tuesday, July 11, 2017

Intel today launched its new Intel Xeon Scalable processors, claiming that they sport an average 65% performance boost over its prior Broadwell chips.

Toshiba has been reportedly in talks with Western Digital and Foxconn, as well as with an already preferred bidder, as it seeks to re-ignite interest for the $18 billion sale of its chip business.

AMD today announced AMD4U, a program designed to offer to PC buyers creative tools and gaming applications optimized for AMD processors and graphics.

Microsoft on Tuesday called for a national strategy that eliminates the rural broadband gap over the next five years.

Semiconductor companies Samsung Electronics and TSMC are competing for the top spot in the foundry market amid rising demand for smaller and more energy-efficient chips.

At its annual Imec Technology Forum USA in San Francisco, imec research institute described work with new materials, process modules and architectures aimed at alleviating high-density interconnect challenges.

Memory technology licensor and chip vendor Rambus Inc. is working with a financial advisor to study options for its sale, according to a report by Bloomberg.

Twitter rolled out new features on Monday to help users disable notifications from accounts that they want to avoid.

Toshiba has developed the first BiCS FLASH three-dimensional (3D) flash memory utilizing Through Silicon Via (TSV) technology with 3-bit-per-cell (triple-level cell, TLC) technology.

LG Electronics has unveiled a mid-tier series of smartphones with premium features, called Q. The new models, the Q6 and Q6 Plus, share a similar design to the firm's premium, the G6.

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