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Samsung Electronics Is Considering Adding Second 3D NAND Line in China
New 4GHz Predator DDR4 Memory Debuts at Computex 2017
ARM Launches New Cortex A75, A55 and Mali-G72 Processors to Power AI, VR Mobile Tech
ASUS Presents New ZenBook and VivoBook Laptops at Computex 2017
New Toshiba XG5 of NVMe SSDs are Using 64-Layer 3D Flash Memory
Sharp's President Confirms US Panel Plant Plan
Google to Retire the AlphaGo AI Program
Apple is Building AI Chip for iPhone
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Sunday, May 14, 2017

Samsung Electronics is rumored to implement - for the first time - a dual-camera system in its next flagship smartphone Galaxy Note 8.

South Korean semiconductor package company NEPES has commercialized Fan-out panel-level packaging (FOPLP) technology, one of the more controversial topics being discussed in the advanced semiconductor packaging world.

A few days ago, an outbreak of the Trojan encryptor WannaCry started. Security experts called it an epidemic since the extent of it is quite huge, with over 100,000 cases of the attack in just one day. Are you safe?

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