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Thursday, December 19, 2013
 SK hynix To Work With On TSV Chips: report
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Message Text: An executive of SK hynix said Thursday the firm will cooperate with AMD to supply highly-advanced chips for data-intensive devices.

"SK hynix will mass-produce high bandwidth memory (HBM) chips by using state-of-art through-silicon via (TSV) technology from the latter half of next year at our DRAM plant in Icheon, Gyeonggi Province," the executive told The Korea Times.

"We will partner with AMD to meet the explosive worldwide demand for HBM chips."

The executive said the firm will ship HBM chip samples to its current customers within the first half of next year, without disclosing their names.

TSV technology allows memory and logic circuitry to be place in the same package. The chip offers enhanced memory performance with significantly less power consumption. TSV is used for mobile processors such as tablets and smartphones.

"The HBM chips will initially be used in high-end graphic processors before being incorporated into super computers, networks and servers later," he said.


 
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