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Friday, July 26, 2013
Samsung Now Mass Producing Fast Embedded Memory
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Samsung continues to lead the memory technology market by initiating mass
production of the world?s fastest embedded memory - the first eMMC 5.0 devices - in 16 gigabyte (GB), 32GB and 64GB densities for next-generation smartphones and tablets.
Featuring an interface speed of 400 megabytes per second (MB/s), the eMMC PRO
memory provides ultra-fast application booting and loading. The chips will
enable much faster multi-tasking, web-browsing, application downloading and file
transfers, as well as high-definition video capture and playback, and are highly
responsive to running large-file gaming and productivity applications.
"With timely mass production of our ultra-fast eMMC PRO line-up offering a more
than 10X performance increase over external memory cards, Samsung will
accelerate the spread of high-end mobile devices as the market for devices with
larger screens and more multimedia functionality expands even further," said
KyongMoo Mang, vice president of memory marketing.
Samsung's eMMC PRO memory chips, being produced in 16, 32 and 64GB versions, are
based on Samsung 64Gb 10nm class NAND flash technology.
The new Samsung chips support the eMMC version 5.0 standard now nearing
completion at JEDEC - the largest standards-setting body in the microelectronics
industry.
In 32GB and 64GB densities, the new memory solution has a random read speed of
7000 IOPS (inputs/outputs per second), and a random write speed of 7000 IOPS (in
cache on mode, without host overhead). In addition, these chips read
sequentially at 250MB/s and write sequentially at 90MB/s.
As the fastest eMMC devices at more than 10 times the speed of a class 10
external memory card (which reads at 24MB/s and writes at 12MB/s), the new
mobile memory greatly enhances the movement from one application to another in
multitasking activities.
Samsung's 16GB, 32GB and 64GB eMMC 5.0 devices come in 11.5x13mm packages.
The eMMC PRO 5.0 chips come with Samsung?s own intelligent NAND controller and
firmware to provide a vertically integrated mobile DRAM solution. |
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