Rambus and MediaTek Sign Patent License Agreement

Monday, March 5, 2012

Rambus and MediaTek Sign Patent License Agreement

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Rambus has signed a patent license agreement with MediaTek, which covers the use of Rambus patents in integrated circuit (IC) products offered by the Taiwanese chip company.

In addition, the two companies have settled all outstanding claims, including resolution of past use of Rambus? patented innovations. The term of this patent license agreement is five years. Other terms of the agreement are confidential.