IBM, Samsung and GLOBALFOUNDRIES to Showcase Next-Generation Chip Technology at Forum

Wednesday, February 8, 2012

IBM, Samsung and GLOBALFOUNDRIES to Showcase Next-Generation Chip Technology at Forum

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IBM, Samsung and GLOBALFOUNDRIES will preview their latest developments in silicon technology at the 2012 Common Platform Technology Forum to be held at the Santa Clara Convention Center on March 14.

The companies will address next-generation semiconductor innovation covering critical topics such as 28-, 20- and 14-nanometer processes, as well as innovations beyond 14nm and 450mm wafer manufacturing. Technology jointly developed by the Common Platform companies -- including more than 20 additional member companies -- power the majority of the world's mobile devices and consumer electronics.