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Wednesday, November 16, 2011
 Amazon Kindle Fire Teardown
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Message Text: Amazon.com's Kindle Fire tablet uses components from Texas Instruments, Samsung, LG and Hynix Semiconductor, according to an iFixit teardown.

Amazon's tablet shipped on Monday and the largest Internet retailer is expected to sell as many as five million of the devices in the fourth quarter and more next year.

IFixit opened the Kindle Fire and found that the device includes chips made by Texas Instruments (TI,) Samsung and Hynix. Specifically, the device uses 8GB of Samsung KLM8G2FEJA flash memory, 512 MB of Mobile DDR2 RAM made by Hynix (H9TKNNN4K) and it is powered by a a Texas Instruments 1 GHz OMAP 4430 processor. Other TI chips inside te device inlcude a TI 603B107 fully integrated power management IC, a TI LCDS83B FlatLink 10-135 MHZ transmitter, a TI AIC3110 low-power audio codec with 1.3W stereo class-D speaker amplifier, a TI WL1270B 802.11 b/g/n Wi-Fi solution and a TI WS245 4-Bit Dual-Supply bus transceiver.

The Kindle Fire's 7" (diagonal) display is made by LG, iFixit added.

The Kindle Fire looks similar to the BlackBerry PlayBook from Research in Motion, leading some analysts to speculate the devices have the same components such as motherboard, battery and display.
 
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