|
|
Wednesday, November 17, 2010
|
University of New Mexico Claims Intel Infringes Lithography Technology
|
|
You are sending an email that contains the article
and a private message for your recipient(s). |
| Your Name: |
|
| Your e-mail: |
* Required! |
| Recipient (e-mail): |
* |
| Subject: |
* |
| Introductory Message: |
|
HTML/Text
(Photo: Yes/No) |
(At the moment, only Text is allowed...)
|
| |
|
| Message Text: |
Following similar suits the university has filed against Samsung,
TSMC, and Toshiba, the University of New Mexico's technology-transfer arm (STC) is claiming Intel is infringing its patent, "Method and
Apparatus for Extending Spatial Frequencies in Photolithography
Images."
STC is charging Intel with patent infringement of a University of New
Mexico invention that improves the capability of semiconductor
manufacturers to fabricate advanced chips. STC filed a complaint today
against Intel in the United States District Court in the district of
New Mexico.
STC currently has licenses for its double patterning lithography
technology with five companies: Toshiba, NEC/Renesas, Samsung, Hynix
and TSMC. The STC patent pertains to lithographic methods that allow
for the manufacture of smaller features in semiconductor devices. As
manufacturers seek to shrink critical dimensions within chips, in
accordance with Moore's law, this patented technology has emerged as a
key solution to the fabrication of advanced devices.
STC said that it has filed this complaint to ensure that the interests
of the University of New Mexico, its inventors and its licensees are
protected and that the STC receives the compensation to which it is
entitled for Intel Corporation?s unlicensed use of the advanced
technology.
Lisa Kuuttila, STC?s President & CEO, stressed that STC has contacted
Intel Corporation with regards to the patented technology: "While STC
was reluctant to use the courts to enforce our patent rights, we have
no other recourse given our duty to protect the intellectual property
of our inventors and the University."
STC's double patterning lithography technology, which issued as a
patent in 2000, was developed by several researchers at UNM, including
Dr. Steven R. J. Brueck. Dr. Brueck is a Distinguished Professor in
the Department of Electrical and Computer Engineering and the
Department of Physics and Astronomy and is the Director of UNM's
Center for High Technology Materials.
STC?s complaint identifies Intel as infringing STC's United States
Patent No. 6.042.998, entitled "Method and Apparatus for Extending
Spatial Frequencies in Photolithography Images." STC is asking the
court to declare that Intel is infringing its patent. The court will
also be asked to order Intel to pay damages to STC. |
|
|
|
|