Kingmax Releases "Invisible" DRAM Module Heat Sink

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Monday, June 07, 2010

Kingmax Releases "Invisible" DRAM Module Heat Sink

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KINGMAX today announced new DDR3 2400MHz memory modules featuring what the company calls the "Nano Thermal Dissipation Technology."

The new memory does not rely on the traditional heat sink which has add weight and volume to the traditional memory modules. The adopted Nano Thermal Dissipation Technology uses a nano-size thermal dissipation silicon compound to increase the release of radiant heat. The nano-size silicon compound fills up the invisible vacant space of smooth surfaces to remove the heat more quickly. "It is like a sponge, pulls the heat and releases into the air at a faster rate than normal product by it self," KNNGMAX says.

Furthermore, the silicon compound could be remixed into the resin for product packaging, further improving the thermal dissipation.

Features of KINGMAX Long-DIMM DDRIII 2400 Dual-Channel:

 Support Intel P55 Chipset
 Adopting Nano Thermal Dissipation Technology
 ASIC chip embedded for anti-counterfeiting purpose
 Lead-free production process
 TinyBGA technology adopted: with advantages as compact size, well heat dissipation and low EM interference
 100% product compatibility and stability
 High data transfer performance for overclocking enthusiasts and hardcore gamers

 240-pin DDRIII 2400MHz
 CAS Latency: 10
 Bandwidth: 19.2GB/sec
 Voltage: 1.5~1.8v
 Capacity: 4GB (2GB*2)
 Worldwide lifetime warranty