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Tuesday, January 19, 2010
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Hitachi Releases First Media Converter for 40 Gigabit Ethernet
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Hitachi Cable, Ltd. has announced the development of an XLGMC-1001 media converter, the world's first product to comply with the 40 Gigabit Ethernet specifications currently under standardization by the IEEE802 committee.
The product is slated for release in June 2010, when the 40 Gigabit Ethernet standard is expected to be officially released.
To handle greater data transfer volumes, companies are now switching interoffice networks from conventional dedicated telecommunication lines such as ATM and SONET to faster, higher-capacity, and less costly wide-area Ethernet networks. In light of this trend and to meet growing traffic volume, the IEEE802 committee is working to standardize next-generation 40 Gigabit/100 Gigabit Ethernet.
Hitachi Cable has developed the XLGMC-1001 media converter that supports the new 40 Gigabit Ethernet interface standard, the first such product anywhere in the world. The XLGMC-1001 adopts a Wavelength Division Multiplexing (WDM) transmission system to divide the 40 Gigabit Ethernet signal into four 10 Gigabit signals and encode them for transmission. This system eliminates the effects of Chromatic Dispersion(CD) and Polarization Mode Dispersion (PMD)0 that have become obstacles to high-speed transmission, achieving one-fiber bidirectional transmission for a maximum transmission distance of 80 km. This transmission performance is equivalent to that of a conventional 10 Gigabit media converter.
The XLGMC-1001 offers a QSFP transceiver port as a user interface, providing support for 40GBASE-SR4 for connections to multimode optical fiber cable and 40GBASE-CR4 for connections to copper cable. Hitachi Cable also plans to support XL2 small optical transceiver providing support for 40GBASE-LR4 for connection to single-mode optical fiber cable, enabling interconnection to a wide range of 40 Gigabit Ethernet equipments.
In addition, the XLGMC-1001 is packaged in the slim 1U (height: 44 mm) form factor, using miniaturized 10 Gigabit electronic components and high-density packaging technologies. |
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