|
|
Thursday, January 15, 2009
|
AMD Offers New Package Features for Embedded Markets
|
|
You are sending an email that contains the article
and a private message for your recipient(s). |
| Your Name: |
|
| Your e-mail: |
* Required! |
| Recipient (e-mail): |
* |
| Subject: |
* |
| Introductory Message: |
|
HTML/Text
(Photo: Yes/No) |
(At the moment, only Text is allowed...)
|
| |
|
| Message Text: |
AMD today announced availability of the AMD Sempron 210U and 200U processors for embedded systems.
 These new processors are available with five year longevity that is standard for AMD embedded components and feature lidless Ball Grid Array (BGA) packaging with the low power and high performance of AMD's Direct Connect Architecture.
"These new lidless BGA packaged processors can help customers significantly shrink their embedded design into new smaller, flatter form factors without having to sacrifice any computing performance," said Buddy Broeker, director, Embedded Product Marketing, AMD. "Retail touch screens, self-service kiosks and digital signage are a growing part of the consumer experience and thin client computing continues to play a strong role in helping businesses become more efficient. These new processor features will help our customers stay on the cutting edge of embedded system design."
Embedded systems based on the AMD Sempron 210U and 200U processors are also available from iBASE, aValue, EVOC, Gigabyte, and Inventec while additional AMD embedded customers are expected to bring systems to market in 2009.
For more information visit http://www.amd.com/embedded. |
|
|
|
|