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Wednesday, July 25, 2007
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STMicroelectronics and IBM to Collaborate on Chip Technology
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STMicroelectronics and IBM today announced that the two companies
have signed an agreement to collaborate on the development of
next-generation process technology -- the "recipe" that is used in
semiconductor development and manufacturing.
The agreement includes 32-nanometer (nm) and 22nm complementary
metal-oxide-semiconductor (CMOS) process-technology development,
design enablement and advanced research adapted to the manufacturing
of 300-millimeter (mm) silicon wafers. In addition it includes both
the core bulk CMOS technology and value-added derivative
System-on-Chip (SoC) technologies. The new agreement between IBM and
ST will also include collaboration on IP development and platforms to
speed the design of system-on-chip devices in these technologies.
As part of the agreement, each company will establish a technical
development team at the other company's facility. For bulk CMOS
development, ST will establish a research and development team in
IBM's Semiconductor Research and Development Center in East Fishkill
and Albany, New York. At the same time, IBM will establish a research
and development team at ST's 300mm wafer semiconductor R&D and
fabrication facility in Crolles, France, where the two companies will
jointly develop a variety of value-added derivative technologies,
such as embedded memory and analog/RF. These technologies can be
broadly applied in consumer and server markets and in wireless
applications, such as cell phones and global positioning devices.
STMicroelectronics will join a partnership of semiconductor
manufacturing, development and technology companies who collaborate
to address the design complexity and advanced process development
necessary for producing smaller, faster, more cost efficient
semiconductors.
Similarly, IBM and ST will work together to expand the network at
ST's 300mm wafer semiconductor fabrication facility in France to
include other members of IBM's CMOS technology alliance interested in
the development of value-added derivative SoC technologies.
The jointly developed processes will be ramped up into volume
production at ST's 300mm wafer semiconductor fabrication facility
(Crolles, France), as well as in the Common Platform manufacturers'
300mm facilities, which includes IBM.
Financial details relating to this deal were not disclosed. |
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