|
|
Monday, May 14, 2007
|
DDR3 Memory Components Validated to Work with Intel's DDR3 Chipsets
|
|
You are sending an email that contains the article
and a private message for your recipient(s). |
| Your Name: |
|
| Your e-mail: |
* Required! |
| Recipient (e-mail): |
* |
| Subject: |
* |
| Introductory Message: |
|
HTML/Text
(Photo: Yes/No) |
(At the moment, only Text is allowed...)
|
| |
|
| Message Text: |
DDR3 solutions provided by memory makers including Samsung and Elpida have been validated on Intel 's reference platform to work with Intel?s next generation DDR3 (Double Data Rate - Version 3) chipsets.
DDR3 memory will provide at least twice the bandwidth of today's
primary memory ? DDR2 ? with data transfer rates now up to 1.6Gb/s.
This will enable much improved 3D graphics, which will directly
benefit users of the new Vista operating system. DDR3 also improves
the efficiency of multi-threading operations, which will enhance
the performance of multi-core systems. DDR3 not only allows for
higher system performance, but it also uses only 1.5V of power
compared to the 1.8V of DDR2, thereby extending battery life in
notebooks. To further optimize system thermal management, DDR3
modules can utilize a thermal sensor on the dual in-line memory
module (DIMM).
Samsung announced today that 21 of its DDR3 solutions have been succesfully validated by Intel. The solutions include 13 modules and eight monolithic devices in combinations of 512Megabit (Mb)/1Gigabit (Gb) densities with speeds of 800 or 1066Mb/ps.
The company plans to begin
full-scale mass production of its DDR3 chips later this quarter.
In addition, Japanese Elpida Memory, Inc. has also
received Intel's validation of its DDR3 main memory based on the
G33 chipset reference platform.
Elpida is now shipping SO-DIMM for notebook PCs and is preparing
for volume shipments of registered DIMM for servers by making this
product available to chipset vendors and major customers for
evaluation. Elpida's 1G bit DDR3 memory using 70nm process technology will be coming soon. |
|
|
|
|