Thursday, March 28, 2024
Search
  
Monday, April 23, 2007
 Akita Elpida Memory Stacks 20 Dies in One MCP
You are sending an email that contains the article
and a private message for your recipient(s).
Your Name:
Your e-mail: * Required!
Recipient (e-mail): *
Subject: *
Introductory Message:
HTML/Text
(Photo: Yes/No)
(At the moment, only Text is allowed...)
 
Message Text: Akita Elpida Memory, Inc. said it has developed the world's thinnest Multi Chip Package (MCP) with 20 stacked dies.

To achieve 30 ?m thick chips the company used grinding technology and developed handling technology for such thin die. Akita Elpida also developed 40-micron low-loop wire-bonding technology and the means to inject resin into narrow gap.

Akita Elpida said it plans from now on to put this package technology to work to establish high-yield and low-cost manufacturing technology for multi-chip stacked packages such as existing 5- and 7-die multi-chip stacked packages.

Akita Elpida was created in July 2006 by DRAM maker Elpida Memory Inc. with a business scope focusing on semiconductor back-end processes.
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2024 - All rights reserved -
Privacy policy - Contact Us .