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Thursday, January 11, 2007
 Rambus and Spansion In Patent Agreement
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Message Text: Rambus and Spansion announced today that they have signed a patent license agreement.

This five-year, royalty-based agreement grants Spansion a license to a broad range of Rambus patents. Rambus said that it does not expect revenue generated from this license agreement to be material. Specific terms of the agreement are confidential.

Spansion joins a growing list of semiconductor suppliers and system manufacturers who have signed patent license agreements for various products covered by Rambus patents. Other companies include AMD, Elpida, Fujitsu, Qimonda, Matsushita, NEC, Renesas, and Toshiba.
 
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