Tuesday, April 23, 2024
Search
English
Optical Storage
Graphics Cards
General Computing
PC Parts
Digital Cameras
Consumer Electronics
Games
Mobiles
All News Categories
Older News
Optical Storage
Graphics Cards
General Computing
PC Parts
Digital Cameras
Consumer Electronics
Games
Cooling Systems
Mobiles
Software Reviews
Reviews Around the Web
Technology Previews
Essays
Interviews
Tech Views
Glossary
FAQ
Guides/How-To's
Firmware
Drivers
BIOS
Software
Media Tests
Drive Comparisons
DVD Media Formats
All Forums
Become Member
Today's Posts
Popular Topics
In-House
Optical Storage
Optical Storage Software
General
Consumer Electronics
Other
News Around The Web
Advertise
Links
Jobs
Site Map
News/Reviews Feed
Submit News
Polls
Competitions
Users' Privacy
Contact Us
About
Home
|
News
|
Reviews
|
Articles
|
Guides
|
Download
|
Expert Area
|
Forum
|
Site Info
Thursday, December 21, 2006
Samsung Develops 1/4 inch 3-megapixel CMOS Image Sensor for Camera Phones
You are sending an email that contains the article
and a private message for your recipient(s).
Your Name:
Your e-mail:
* Required!
Recipient (e-mail):
*
Subject:
*
Introductory Message:
HTML/Text
(Photo: Yes/No)
(At the moment, only Text is allowed...)
Message Text:
Samsung announced the first 3-megapixel (M-pixel) CMOS image sensor (CIS) with a 1/4-inch lens aperture for ultra slim camera phones.
Samsung's new 1.75um-size pixel enables the 1/4-inch lens aperture to reduce the camera module size by 30 percent as opposed to a conventional 2.25um pixel 1/3-inch lens aperture 3M-pixel CIS. The small form factor allows the 1.75um-pixel, 1/4-inch lens aperture 3M-pixel CIS to immediately replace a 1/4-inch lens aperture 2M-pixel CIS module, as it shares the same physical measurements with the new 3M-pixel CIS.
Samsung claims that the 1.75um pixel, 1/4-inch lens aperture 3M-pixel CIS shows no degrading in the picture quality compared to a 2.25um pixel, 1/3-inch lens aperture 3M-pixel CIS.
By utilizing 90-nanometer (nm) process technology, Samsung expects to mass produce the new 1.75um pixel, 1/4-inch lens aperture 3-Mp CIS in the first quarter of 2007. The new CIS chip uses Samsung's proprietary 90nm copper technology that reduces the distance between the micro-lens to the photo diode thereby resulting in maximizing the light-gathering efficiency to overcome the potential decline of image quality as the pixel size scales down.
Home
|
News
|
All News
|
Reviews
|
Articles
|
Guides
|
Download
|
Expert Area
|
Forum
|
Site Info
Site best viewed at 1024x768+ -
CDRINFO.COM
1998-2024 - All rights reserved
-
Privacy policy
-
Contact Us
.