Rambus Signs Patent License Agreement With Renesas

Thursday, September 29, 2005

Rambus Signs Patent License Agreement With Renesas

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Rambus today announced it has signed a patent license agreement with Renesas Technology Corp. that allows the development and manufacture of integrated circuits (ICs) employing interfaces based on Rambus' patented inventions.

The agreement is for a five-year term and covers memory, high-speed controllers and other interfaces invented by Rambus. Under the agreement, Renesas will provide monetary and other compensation to Rambus. Specific terms of the agreement are confidential.

"Renesas is a global leader in the semiconductor market and signing this renewal represents strong validation of our patent portfolio," said Harold Hughes, chief executive officer at Rambus. "This agreement continues our relationship with an industry leader and expands the availability of our technology in the market."