Sunday, September 25, 2016
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
Snapchat Introduces 'Spectacles' Camera-equipped Glasses, Changes Company name To Snap
Nvidia GPUs Could Return To Apple Macs
Lenovo Brings Fingerprint Authenticated Payments To Laptops
Report Cites Google, Salesforce Interest For Twitter
Dalian Wanda and Sony Enters Team Up in China Movie Business
Apple Develops Amazon Echo-Style Device
ALD Technology Chosen By Samsung, LG For Flexible OLEDs
TSMC To Use Different Processes And 3D Packages Across Future Design Platforms
Active Discussions
Which of these DVD media are the best, most durable?
How to back up a PS2 DL game
Copy a protected DVD?
roxio issues with xp pro
Help make DVDInfoPro better with dvdinfomantis!!!
menu making
Optiarc AD-7260S review
cdrw trouble
 Home > News > Optical Storage > Toshiba...
Last 7 Days News : SU MO TU WE TH FR SA All News

Thursday, January 22, 2004
Toshiba develops nine-layered packaging technology


Toshiba said it has developed a multichip package that can stack up to nine chips in its 1.4-mm high package. The technology adds three additional layers to the same height currently used for six-layer packages. Toshiba expects new technology will provide more powerful and functional solutions in a single package.

The new package combines a range of memory chips, including SRAM, SDRAM, pseudo-SRAM, NOR flash memory and NAND flash memory.

The nine-layer package uses Toshiba's technology to grind each chip to a thickness of 70 microns. Then it can be stacked without breakage, said a Toshiba spokesman. The chip is 15 microns thinner than conventionally used chips in multichip packages, he said.

A sample showing a common combination of chips houses SRAM, SDRAM, three NOR flash and one Nand flash with three spacers. Total capacity for the device was 776 Mbits. The sample measures 11 x 14mm and is 1.4-mm high. It uses 225 balls with a 0.65-mm pitch. Power supply was 1.8 V.

The package provides Toshiba's proprietary three-bus system for data transfer between the multichip package and a CPU. A high-speed bus supports SDRAM and NOR, a middle-speed bus supports SRAM and NOR and a dedicated bus supports NAND.

Toshiba will begin volume production of the multichip package that include memory combinations specified by customers.


Previous
Next
Primera Technology introduces new lower pricing on ComposerMAX        All News        Primera Technology introduces new lower pricing on ComposerMAX
Primera Technology introduces new lower pricing on ComposerMAX     Optical Storage News      Primera Technology introduces new lower pricing on ComposerMAX

Get RSS feed Easy Print E-Mail this Message

Related News
Toshiba Expands 24nm SLC Flash Family with 16Gb Offering
Toshiba Introduces the OCZ VX500 SATA SSD Series
Toshiba to Implement Eyefi Connected Features in Next FlashAir SD Cards
Toshiba Debuts Flashmatrix Technology
Toshiba Announces New BG SSDs with 3-Bit-Per-Cell TLC BiCS FLASH
Toshiba's ZD6000 Dual Port NVMe SSD Offers A Capacity Of 7.68TB
Toshiba PC Business Not Affected By Company's Restructuring
Toshiba Develops High-Speed MTJ Element for Non-Volatile STT-MRAM For 2X nm Generation Transistors
Toshiba Develops Circuit Technology for Small Area Non-volatile FPGAs
New Imaging Technique Can Simultaneously Acquire a Color Image and Depth Map from a Single Image Taken with a Monocular Camera
New Toshiba 8TB X300 Hard Disk Drive Released
Fujitsu, Vaio, Toshiba, Abandon PC Merger Plans

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2016 - All rights reserved -
Privacy policy - Contact Us .