Thursday, April 24, 2014
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
Tech Companies Unite To Boost OpenSSL, Security
Facebook Introduces Newswire For Journalists
Surface Mini Accessories Appera On Amazon
OCZ Launches the RevoDrive 350 PCIe SSD
Sony Introduces New High-Resolution Audio A/V Receivers, Speakers and Blu-ray Home Theater Systems
Updated Apple TV Set For Release In June
ASUS to Unleash Full SATA Express Performance With SRIS
IBM Tackles Big Data Challenges with Open Server Model
Active Discussions
help questions structure DVDR
Made video, won't play back easily
Questions durability monitor LCD
Questions fungus CD/DVD Media, Some expert engineer in optical media can help me?
CD, DVD and Blu-ray burning for Android in development
IBM supercharges Power servers with graphics chips
Werner Vogels: four cloud computing trends for 2014
Video editing software.
 Home > News > Optical Storage > Toshiba...
Last 7 Days News : SU MO TU WE TH FR SA All News

Thursday, January 22, 2004
Toshiba develops nine-layered packaging technology


Toshiba said it has developed a multichip package that can stack up to nine chips in its 1.4-mm high package. The technology adds three additional layers to the same height currently used for six-layer packages. Toshiba expects new technology will provide more powerful and functional solutions in a single package.

The new package combines a range of memory chips, including SRAM, SDRAM, pseudo-SRAM, NOR flash memory and NAND flash memory.

The nine-layer package uses Toshiba's technology to grind each chip to a thickness of 70 microns. Then it can be stacked without breakage, said a Toshiba spokesman. The chip is 15 microns thinner than conventionally used chips in multichip packages, he said.

A sample showing a common combination of chips houses SRAM, SDRAM, three NOR flash and one Nand flash with three spacers. Total capacity for the device was 776 Mbits. The sample measures 11 x 14mm and is 1.4-mm high. It uses 225 balls with a 0.65-mm pitch. Power supply was 1.8 V.

The package provides Toshiba's proprietary three-bus system for data transfer between the multichip package and a CPU. A high-speed bus supports SDRAM and NOR, a middle-speed bus supports SRAM and NOR and a dedicated bus supports NAND.

Toshiba will begin volume production of the multichip package that include memory combinations specified by customers.


Previous
Next
Primera Technology introduces new lower pricing on ComposerMAX        All News        Primera Technology introduces new lower pricing on ComposerMAX
Primera Technology introduces new lower pricing on ComposerMAX     Optical Storage News      Primera Technology introduces new lower pricing on ComposerMAX

Get RSS feed Easy Print E-Mail this Message

Related News
Toshiba Announces Canvio AeroMobile Wireless SSD
Toshiba, SanDisk Mass Produce 15nm NAND flash Memory
Toshiba Joins GLOBALSOLUTIONS Ecosystem
Toshiba Debuts World's Fastest microSD Memory Cards
Toshiba 4K Ultra HD Laptop Retails For $1500
Toshiba to Launch 40-inch 4K TV
Toshiba Introduces Its own Application Processor For Wearables
Toshiba Launches Interface Bridge ICs that Supports SeeQVault Content Security Technology
Toshiba Self-encrypting HDD Meets Government-class Security Requirements
Toshiba Canvio Wireless Adapter Transforms External Hard Drives Into NAS Devices
Toshiba To Ship New 4K Laptops Later This Year
Toshiba Develops Medical Breath Analyzer

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2014 - All rights reserved -
Privacy policy - Contact Us .