Friday, October 09, 2015
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
AT&T Customers Allowed To Make Calls Over Wi-Fi
Amazon Launches App Developing Platform For IoT
18.4-inch Samsung Galaxy View Tablet Passes FCC Certification
Facebook to Test Emoji Icons
Lite-On Introduces New EP2 SSD With NVMe Protocol
SanDisk and HP Team Up to Create Memory-Driven Computing Solutions
IBM Takes On Intel's x86 Systems With New Linux Servers
LG Triples OLED TV Line-up, Slashes Prices
Active Discussions
How to back up a PS2 DL game
Copy a protected DVD?
roxio issues with xp pro
How to burn a backup copy of The Frozen Throne
Help make DVDInfoPro better with dvdinfomantis!!!
Copied dvd's say blank in computer only
menu making
Optiarc AD-7260S review
 Home > News > Optical Storage > Toshiba...
Last 7 Days News : SU MO TU WE TH FR SA All News

Thursday, January 22, 2004
Toshiba develops nine-layered packaging technology

Toshiba said it has developed a multichip package that can stack up to nine chips in its 1.4-mm high package. The technology adds three additional layers to the same height currently used for six-layer packages. Toshiba expects new technology will provide more powerful and functional solutions in a single package.

The new package combines a range of memory chips, including SRAM, SDRAM, pseudo-SRAM, NOR flash memory and NAND flash memory.

The nine-layer package uses Toshiba's technology to grind each chip to a thickness of 70 microns. Then it can be stacked without breakage, said a Toshiba spokesman. The chip is 15 microns thinner than conventionally used chips in multichip packages, he said.

A sample showing a common combination of chips houses SRAM, SDRAM, three NOR flash and one Nand flash with three spacers. Total capacity for the device was 776 Mbits. The sample measures 11 x 14mm and is 1.4-mm high. It uses 225 balls with a 0.65-mm pitch. Power supply was 1.8 V.

The package provides Toshiba's proprietary three-bus system for data transfer between the multichip package and a CPU. A high-speed bus supports SDRAM and NOR, a middle-speed bus supports SRAM and NOR and a dedicated bus supports NAND.

Toshiba will begin volume production of the multichip package that include memory combinations specified by customers.

Primera Technology introduces new lower pricing on ComposerMAX        All News        Primera Technology introduces new lower pricing on ComposerMAX
Primera Technology introduces new lower pricing on ComposerMAX     Optical Storage News      Primera Technology introduces new lower pricing on ComposerMAX

Get RSS feed Easy Print E-Mail this Message

Related News
Toshiba's Image Sensor for Iris Recognition Improves Recognition And Security
Toshiba's Satellite Click 10 Detachable 2-in-1 PC Now Available
Toshiba Reports Q1 Loss on Weak PC, TV Sales
Toshiba Reports Significant Loss Following Accounting Scandal
Toshiba's New PCs Combine Functionality, Mobility and Performance
Toshiba At IFA 2015
Toshiba Launches Wireless Power Receiver IC for Quick Charging Mobile Devices
Toshiba Unveils Three NVME Solid State Drive Families
Toshiba Develops First 16-die Stacked NAND Flash Memory with TSV Technology
Toshiba Announces Third Generation of Enterprise SAS SSDs, Starts Production Of 3D NAND
Toshiba Expands Line-up of ARM Cortex -M-based Microcontrollers
Toshiba CEO Resigns Following Accounting Scandal

Most Popular News
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2015 - All rights reserved -
Privacy policy - Contact Us .