Saturday, January 21, 2017
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
Apple Sues Qualcomm Over Patent Royalties
Sharp Establishes New Research and Development Center for Home Appliances in China
Samsung Seeks Arbitration Over LCD Supply Halt
Canon May Invest In Toshiba's Chip Business
Samsung To Explain What Caused The Galaxy Note 7's ban In Press Event
Nintendo's 'Fire Emblem Heroes' Smartphone Game features in-app Purchases
Fujifilm X-T20 Features New 24MP Sensor and 4K Video Capture
Samsung Begins Rollout of Android 7.0 Nougat
Active Discussions
Which of these DVD media are the best, most durable?
How to back up a PS2 DL game
Copy a protected DVD?
roxio issues with xp pro
Help make DVDInfoPro better with dvdinfomantis!!!
menu making
Optiarc AD-7260S review
cdrw trouble
 Home > News > Optical Storage > Toshiba...
Last 7 Days News : SU MO TU WE TH FR SA All News

Thursday, January 22, 2004
Toshiba develops nine-layered packaging technology


Toshiba said it has developed a multichip package that can stack up to nine chips in its 1.4-mm high package. The technology adds three additional layers to the same height currently used for six-layer packages. Toshiba expects new technology will provide more powerful and functional solutions in a single package.

The new package combines a range of memory chips, including SRAM, SDRAM, pseudo-SRAM, NOR flash memory and NAND flash memory.

The nine-layer package uses Toshiba's technology to grind each chip to a thickness of 70 microns. Then it can be stacked without breakage, said a Toshiba spokesman. The chip is 15 microns thinner than conventionally used chips in multichip packages, he said.

A sample showing a common combination of chips houses SRAM, SDRAM, three NOR flash and one Nand flash with three spacers. Total capacity for the device was 776 Mbits. The sample measures 11 x 14mm and is 1.4-mm high. It uses 225 balls with a 0.65-mm pitch. Power supply was 1.8 V.

The package provides Toshiba's proprietary three-bus system for data transfer between the multichip package and a CPU. A high-speed bus supports SDRAM and NOR, a middle-speed bus supports SRAM and NOR and a dedicated bus supports NAND.

Toshiba will begin volume production of the multichip package that include memory combinations specified by customers.


Previous
Next
Primera Technology introduces new lower pricing on ComposerMAX        All News        Primera Technology introduces new lower pricing on ComposerMAX
Primera Technology introduces new lower pricing on ComposerMAX     Optical Storage News      Primera Technology introduces new lower pricing on ComposerMAX

Get RSS feed Easy Print E-Mail this Message

Related News
Toshiba May Spin Off Its Semiconductor Business
CES 2017: Toshiba Debuts Portege X20W 2-in-1 Convertible
Toshiba Expands Line-up of Embedded NAND Flash Memory Products for Automotive Applications
Toshiba Expands 3D Flash Memory Production Capacity In New Fabrication Facility at Yokkaichi
Toshiba Advances Deep Learning with Extremely Low Power Neuromorphic Processor
Toshiba's Voice Recognition Technology Can Distinguish Multiple Individual Speakers Without Training
Investors Sue Toshiba Over Accounting Scandal
Toshiba Starts Testing System For Future Self-driving Cars
Toshiba, Tohoku Electric and Iwatani Start Study of World?s Largest Hydrogen Energy System
Toshiba Introduces the Value-oriented OCZ TL100 SATA SSD Series
Toshiba Expands 24nm SLC Flash Family with 16Gb Offering
Toshiba Introduces the OCZ VX500 SATA SSD Series

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2017 - All rights reserved -
Privacy policy - Contact Us .