Tuesday, April 24, 2018
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
First-Quarter Lobbying Expenditures: Google, AT&T, Comcast and Comcast Remain Top Spenders
Samsung Launches Six Original Series on Samsung VR Video Service on Gear VR
Facebook Says Users Are Not Products, the Social Network Is
European Regulators Investigate Apple's Proposed Acquisition of Shazam
Amazon is Working on Home Robots: report
7nm Volume Production to Fuel TSMC's Profits This Year
Toshiba Weighs Memory Chip Unit Options
Google Chat Launches to compete with Apple's iMessage
Active Discussions
Which of these DVD media are the best, most durable?
How to back up a PS2 DL game
Copy a protected DVD?
roxio issues with xp pro
Help make DVDInfoPro better with dvdinfomantis!!!
menu making
Optiarc AD-7260S review
cdrw trouble
 Home > News > Optical Storage > Toshiba...
Last 7 Days News : SU MO TU WE TH FR SA All News

Thursday, January 22, 2004
Toshiba develops nine-layered packaging technology


Toshiba said it has developed a multichip package that can stack up to nine chips in its 1.4-mm high package. The technology adds three additional layers to the same height currently used for six-layer packages. Toshiba expects new technology will provide more powerful and functional solutions in a single package.

The new package combines a range of memory chips, including SRAM, SDRAM, pseudo-SRAM, NOR flash memory and NAND flash memory.

The nine-layer package uses Toshiba's technology to grind each chip to a thickness of 70 microns. Then it can be stacked without breakage, said a Toshiba spokesman. The chip is 15 microns thinner than conventionally used chips in multichip packages, he said.

A sample showing a common combination of chips houses SRAM, SDRAM, three NOR flash and one Nand flash with three spacers. Total capacity for the device was 776 Mbits. The sample measures 11 x 14mm and is 1.4-mm high. It uses 225 balls with a 0.65-mm pitch. Power supply was 1.8 V.

The package provides Toshiba's proprietary three-bus system for data transfer between the multichip package and a CPU. A high-speed bus supports SDRAM and NOR, a middle-speed bus supports SRAM and NOR and a dedicated bus supports NAND.

Toshiba will begin volume production of the multichip package that include memory combinations specified by customers.


Previous
Next
Primera Technology introduces new lower pricing on ComposerMAX        All News        Primera Technology introduces new lower pricing on ComposerMAX
Primera Technology introduces new lower pricing on ComposerMAX     Optical Storage News      Primera Technology introduces new lower pricing on ComposerMAX

Get RSS feed Easy Print E-Mail this Message

Related News
Toshiba Weighs Memory Chip Unit Options
Toshiba Releases New Surveillance, Video Streaming Laptop and Desktop Hard Drives
China Opposes SK hynix-Toshiba Deal
Toshiba Delays Memory Chip Unit Sale
Toshiba Memory to Make New Investment in Production Equipment for Fab 6 at Yokkaichi Operation
Toshiba Launches KumoScale NVM Express over Fabrics Storage Software for Cloud Infrastructures
Toshiba Adds 64-layer BiCS CD5, XD5 and HK6-DC Models to Data Center SSD Lineup
Western Digital to Inject $4.6bn in Toshiba Memory
Toshiba Completes Transfer of its TV Business to Chinese Hisense Group
Toshiba Releases 2TB Hard Disk Drive for Notebooks
Toshiba Reveals Fresh Canvio Portable Hard Drive Models
Toshiba Officially Unveils Mainstream RC100 NVMe SSD Series

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2018 - All rights reserved -
Privacy policy - Contact Us .