Sunday, June 24, 2018
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
FCC to Seek for Flexible Use of C-band and 6GHz Airwaves
AMD Presents Modular Routing Design for Chiplet-based Systems
Software Business Continues to Work For BlackBerry
Apple Turns to the U.S. Patent Office to Invalidate Qualcomm Patents
Samsung Patents Bezel-less, Notch-free Smartphone Design
China is Home to Most Smartphone Vendors
VidCon 2018: Youtube Announces Memberships, Merchandise as Alternatives to Ads
Chatting With Google Assistant Gets More Natural
Active Discussions
Which of these DVD media are the best, most durable?
How to back up a PS2 DL game
Copy a protected DVD?
roxio issues with xp pro
Help make DVDInfoPro better with dvdinfomantis!!!
menu making
Optiarc AD-7260S review
cdrw trouble
 Home > News > General Computing > Globalf...
Last 7 Days News : SU MO TU WE TH FR SA All News

Thursday, June 07, 2018
Globalfoundries Outlines Dual Road-map Strategy - Advanced 7nm FinFET tape Outs and 22nm FDSOI


Globalfoundries is following a "dual road-map strategy," which sees the company's first 7nm FinFET tape outs happening in the 2H18 with production in 2019 and also work in fully depleted silicon on insulator (FDSOI) processes.

Speaking to EENewseurope.com, Globalfoundries's CTO Gary Patton said that the company's first source customers for the 7nm FinFET tape-outs include AMD, IBM and some other companies via an ASIC design platform.

The company is working on advanced 7nm FinFETs in its Fab 8 complex in Malta and New York.

Globalfoundries plans to use extreme ultraviolet lithography (EUV) with the 7nm process in 2019. The company will launch with optical immersion lithography and then will be able to offer performance enhancement to the 7nm technology.

Patton said that the FinFET 14nm and 7nm are "major" nodes, and that the 10nm node, which Globalfoundries left out of its roadmap, offers just 30 percent die area improvement.

But the 5nm is another half node and 3nm will likely to be the next full node. Patton said that 5nm will likely be the last FinFET node and that 3nm would require significant transistor engineering. He added that nanosheets - flattened lateral nanowires each with a gate all around inside a fin - were a likely candidate for the 3nm process node. And this is something just announced by rival Samsung for their 3nm node coming in or after 2022.

"The introduction of 3nm will be three or four years after 7nm," Patton concluded.

Ragarding FDSOI, Patton said that Globalfoundries has 36 design wins in FDSOI and tape outs on 22FDX. The company's FDXelerator partnership program has launched with 7 partners in 3Q16 and now has 47. Patton said that the company is heading towards 75 partners by the end of the year, with several real IC tape outs on 22FDX already finished and the first tape outs on 12FDX to be expected for 2020.

Globalfoundries is also researching the addition of a second non-volatile memory technology option, and potentially more, to its offering on 22nm FDSOI. The company already offers magnetic RAM (MRAM) on its 22FDX process and is now researching other memory options, according Patton.

Patton stressed that RF elements and millimeter wave circuits on FDSOI are world class making the process good for automobile radar applications. Gloabalfoundries' 22FDX process has just been certified to AEC-Q100 Grade 2 for production. As a part of the AEC-Q100 Grade 2 certification, devices must withstand reliability stress tests for an extended period of time, over a wide temperature range.

But Samsung is dacing the pressure from Samsung, which has announced an 18nm FDSOI follow on.

Samsung is also offering both embedded MRAM and flash options on its 28nm FDSOI and STMicroelectronics has opted for phase-change memory on 28nm FDSOI. TSMC is offering MRAM and a variant of ReRAM as an embedded memory on its 22nm FinFET process.



Previous
Next
ZTE Accepts $1bn Fine to remove U.S. Ban        All News        Amazon to Stream English Premier League Soccer Matches
Tokyo University Develops Hybrid Robot With Real Muscles     General Computing News      Amazon to Stream English Premier League Soccer Matches

Get RSS feed Easy Print E-Mail this Message

Related News
GLOBALFOUNDRIES Launches RF Ecosystem Program to Accelerate the Release of Wireless Connectivity, Radar and 5G Applications
GLOBALFOUNDRIES Extends Silicon Photonics Roadmap to Meet Demand for Datacenter Connectivity
Intel Uses Cobalt Interconnect for 10nm, Global Foundries Detail EUV Lithography for 7nm
Globalfoundries and Intel to Talk About 10, 7nm at IEDM
GLOBALFOUNDRIES Introduces AutoPro Automotive Platform for Connected Cars
Globalfoundries Asks EU to Probe TSMC
GLOBALFOUNDRIES Introduces New 12nm FinFET Technology
GLOBALFOUNDRIES and IBM Develop Custom 14nm FinFET Technology That Leverages both FinFET and SOI
GLOBALFOUNDRIES Says New 7LP Technology Offers 40 Percent Performance Boost Over 14nm FinFET
GLOBALFOUNDRIES and Chengdu Invest in China-based FDX FD-SOI Design Centers
GLOBALFOUNDRIES Invests For Capacity Growth In The US, Germany, China and Singapore
KAIST Sues Samsung, Qualcomm And Globalfoundries Over FinFET Patent Infringement

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2018 - All rights reserved -
Privacy policy - Contact Us .