Monday, August 20, 2018
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
Amazon to Release Live TV Recorder
U.S. Wants to Wiretap Facebook Messenger, Report Says
More Affordable, 13-inch MacBook and $160 AirPower Expected at Apple's Event
Google to Launch Its Own Smart Display, Report Says
Nvidia Reports Record Revenue From Datacenter, Gaming, Professional Visualization, Automotive
Arm Client CPU Roadmap Includes Advanced Hercules and Deimos Chips
Google To Release Lightweight Version of Android Pie for Entry-level Smartphones
Japan Accuses Apple of Pressuring Game Rivals: Nikkei
Active Discussions
Which of these DVD media are the best, most durable?
How to back up a PS2 DL game
Copy a protected DVD?
roxio issues with xp pro
Help make DVDInfoPro better with dvdinfomantis!!!
menu making
Optiarc AD-7260S review
cdrw trouble
 Home > News > PC Parts > Micron ...
Last 7 Days News : SU MO TU WE TH FR SA All News

Tuesday, May 22, 2018
Micron and Intel Deliver First 1Tb - 4bits/cell QLC 3D NAND Die


Micron Technology, Inc. and Intel today announced production and shipment of the first 4bits/cell 3D NAND technology, which leverages a 64-layer structure to achieve 1 terabit (Tb) density per die.

The companies also announced development progress on the third-generation 96-tier 3D NAND structure, providing a 50 percent increase in layers.

Both NAND technology advancements-the 64-layer QLC and 96-layer TLC technologies utilize CMOS under the array (CuA) technology to reduce die sizes and deliver improved performance. The companies claim that by leveraging four planes vs the competitors' two planes, the new Intel and Micron NAND flash memory can write and read more cells in parallel, which delivers faster throughput and higher bandwidth at the system level.

The new 64-layer 4bits/cell NAND technology enables denser storage in a smaller space, bringing significant cost savings for read-intensive cloud workloads. It is also well-suited for consumer and client computing applications, providing cost-optimized storage solutions.

QLC NAND packs 33% more data into every cell compared to its triple-level cell (TLC) equivalent. QLC's additional storage density - coupled with a more approachable price point - can have an immense effect on your read-mostly workloads (TLC is best for mixed use).

Micron has already commenced shipments of the first SSD built on quad-level cell (QLC) NAND technology. Unveiled at Micron's 2018 Analyst and Investor Event, the Micron 5210 ION SSD provides 33 percent more bit density than triple-level cell (TLC) NAND, addressing segments previously serviced with hard disk drives (HDDs).

Available in a 2.5-inch form factor, compared to the traditional 3.5-inch HDD, the Micron 5210 ION SSD reduces server sprawl by packing more performance into fewer racks, which allows data centers to save on expensive power and cooling costs.

The Micron 5210 ION SSD is leveraging the architecture of the 5200 series SATA SSD to deliver the enterprise feature set of Micron's SATA SSDs. Micron's Flex Capacity feature allows for custom-configuration of the drive's endurance and write performance for workloads that have a higher mix of writes but are still mostly read-intensive.

The new SSD is now shipping, with broad market availability expected in the fall of 2018. It will be available in a 2.5-inch (7mm) form factor in capacities ranging from 1.92TB to 7.68TB.



Previous
Next
Spectre Chip Security Flaw Strikes Again, New Patches On the Way        All News        Huawei's MateBook X Pro Laptop Available in the U.S. For $1,200
Razer Blade 15.6" Gaming Laptop Released, New Razer Core X is Powerful and More Affordable     PC Parts News      Huawei's MateBook X Pro Laptop Available in the U.S. For $1,200

Get RSS feed Easy Print E-Mail this Message

Related News
Intel Promotes Optane And QLC Solutions, World's Densest 'Ruler' SSD
Intel Intros 660p Series M.2 NVMe SSDs with QLC NAND Flash
Samsung Starts Mass Production of Industry's First 4-bit Consumer SSD
Western Digital and Toshiba Begin Sampling 96-layer QLC NAND
Micron and Intel to End Their 3D XPoint Joint Development Partnership
Micron Says UMC Patent Ruling Will Have Minimal Impact to Revenue
Micron Chip Sales Banned in China, UMC Says
Micron GDDR6 Memory Enters Volume Production
Micron Had a Record Quarter in Terms of Revenue and Profitability
Cadence and Micron Prototype First DDR5 Memory
Samsung Expands Xian Flash Memory Plant
Micron Launches 5200 SATA Enterprise SSD Featuring 64-layer 3D NAND

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2018 - All rights reserved -
Privacy policy - Contact Us .