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Tuesday, April 03, 2018
GIGABYTE Releases Aorus Motherboards Based on Intel H370 and B360 Chipsets

GIGABYTE TECHNOLOGY is releasing the newest H370 AORUS GAMING 3 WIFI and B360 AORUS GAMING 3 WIFI motherboards.

The motherboards boast Intel CNVi WIFI technology through the Intel Wireless-AC 9560 module for optimized wireless connectivity and a Realtek ALC1220-VB audio CODEC.

When paired with Intel 8th Gen. Core processors, the motherboards deliver next-gen wireless connectivity that is significantly faster and more stable at further range. Under the AORUS design, the 2x2 802.11ac WIFI Wave 2 is optimized for faster download speeds even under dense network traffic as well as delivery speeds up to 1.733 Gbps when using 160 MHz channels, doubling that of standard designs. Simultaneous support for multiple devices is enabled on these boards by their 2T2R Antenna design, resulting in a maximum transmission bandwidth 2x higher than that of previous generations. In addition, the boards offer very fast Ethernet from its Intel GbE LAN with cFos accelerator and WTFast.

Supporting the Intel 8th Gen. Core processors, the H370 and B360 AORUS GAMING 3 WIFI motherboards feature 4 DIMMs Dual Channel DDR4 configuration compatible with memory modules up to 2666MHz. The H370 AORUS GAMING 3 WIFI motherboard utilizes a Hybrid 8+2 Phase PWM design. It provides support for Intel Core i7 8700K processors and with its refined PWM design, ensures that sufficient power is supplied to the power-hungry components while keeping the areas around the CPU less vulnerable to thermal exposure. The motherboards are also designed with highly power-efficient components so that power consumption is compliant with standards set by the CEC 2019 Energy consumption regulations. A BIOS option is available for activating the power-saving mode in which the motherboards conserve up to 15% less power relative to older platforms.

Onboard audio quality is also bolstered by the upgrade to a Realtek ALC1220-VB audio CODEC on these H370 AORUS GAMING 3 WIFI boards. The improvement is noticeable for the front panel MIC with SNR values increased by almost 20% to 110 dB(A).

These H370 and B360 AORUS GAMING 3 WIFI motherboards also feature redesigned M.2 Heatsinks. One of the slots is protected by a M.2 Thermal Guard limiting the effect of thermal throttling and allowing for transfer speeds up to 32 Gbps. Furthermore, the SATA/PCIe dual mode M.2 slot designed by GIGABYTE and support for Intel OPTANE Memory Technology offers plenty of flexibility by allowing the user to install dual M.2 SSDs to enjoy upgraded storage performance. The Intel native USB 3.1 Gen 2 design on these boards enables transfer speed up to 10Gbps.

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