Tuesday, January 16, 2018
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
New Pioneer DDJ-1000 Controller Designed for rekordbox dj
Microsoft AI Can Read a Document and Answer Questions About it as Well as a Person
Fujitsu Releases New Enterprise Tablet and PC Models
Tencent Tries to Tackle Cheaters in PlayerUnknown's Battlegrounds Game
China Also Seeks Answers from Apple About slowing iPhones
BlackBerry Jarvis Will Protect Your Connected Car
iPhone Assembler Hon Hai to Get OLEDs from Sharp
Google's Map to Return to China: report
Active Discussions
Which of these DVD media are the best, most durable?
How to back up a PS2 DL game
Copy a protected DVD?
roxio issues with xp pro
Help make DVDInfoPro better with dvdinfomantis!!!
menu making
Optiarc AD-7260S review
cdrw trouble
 Home > News > General Computing > Tsinghu...
Last 7 Days News : SU MO TU WE TH FR SA All News

Wednesday, January 10, 2018
Tsinghua Unigroup May License 3D NAND flash Technology From Intel


Chinese may finally get their hand on technology for the development of 3D NAND flash chips, with Tsinghua Unigroup to reportedly license the corresponding technology from Intel.

According to "industry sources" quoted by Digitimes.com,
Intel is trying to its presence in China's NAND flash market, with plans to ramp up the capacity of its 12-inch fab in Dalian and possibly to license its technology to Tsinghua Unigroup for production of 3D NAND flash chips.

The news come just a couple of days after Intel and Micron announced plans to wind down their partnership in the 3D NAND field by next year.

Intel and Micron have announced intentions to go their separate ways after introducing their third-generation of 96-layer 3D NAND flash by the end of 2018 or early 2019 at the IM Flash Technologies (IMFT), their 12-year-old joint venture, with the exception for the 3D Xpoint memory.

In 2015, Intel converted its 12-inch wafer plant in Dalian, northeastern China to production of 3D NAND flash from processor chips, aiming to cash in on the increasing demand in the China market.

A possible tie-up between Intel and Tsinghua Unigroup could shake up the global NAND flash sector and become a headache for 3D NAND leader Samsung Electronics and Toshiba, as the that the market might fall into a state of oversupply.



Previous
Next
BOE Presents 75-inch, China-made 8K UHD display at CES 2018        All News        CES: Mushkin Showcases Triactor 3DX, 3DL, Helix-L and Pilot SSDs
Khronos Group Spells Out Details of Neural Network Standard     General Computing News      Renault-Nissan-Mitsubishi to Invest $1 Billion in Next-gen Vehicle Startups

Get RSS feed Easy Print E-Mail this Message

Related News
Microsoft AI Can Read a Document and Answer Questions About it as Well as a Person
Intel Has to Deal With New Security Issue in Laptops
Intel's New "Ruler" Form Factor Saves Precious Space in Computing Systems
Intel Says Security Patches Can Cause Reboot Problems, AMD Acknowledges Chips Exposed to Spectre
Intel Provides More Performance Data Results for Patched Client Systems
CES: Intel Announces the Optane 800P SSD for Consumers
CES: Brian Krzanich Shares New Details on Advances in Autonomous Driving and the Future of Artificial Intelligence
Intel CEO Talks About Security Research Findings at 2018 CES
Micron and Intel to Limit Their NAND Memory Joint Development Program
CES: Intel Launches Most Powerful NUC, 8th Gen Intel Core Processors with Radeon RX Vega M Graphics
Industry Downplays Performance Impact of Meltdown and Spectre, Releases Patches
Intel Releases Updates to Protect Systems from Security Exploits

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2018 - All rights reserved -
Privacy policy - Contact Us .