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Monday, November 6, 2017
ITC Launches Probe into Samsung's Chipmaking Patent


The U.S. International Trade Commission (ITC) has launched an investigation into an allegation that Samsung Electronics infringed on patented wafer packaging technologies of Tessera Advanced Technologies.

The ITC began a probe on October 31 into specific wafer level packaging (WLP) semiconductor devices and products containing them under a Section 337 patent infringement action. WLP refers to a technology that simplifies the packaging of wafers and reduces the volume of products.

The ITC investigation came in response to a complaint recently filed by U.S. semiconductor packaging firm Tessera Advanced Technologies which accused Samsung of violating two patents regarding its WLP technology.

Tessera also asked the ITC to exclude Samsung`s semiconductor chips and Galaxy and Note smartphones that contain such chips from import.

Under the procedure, the ITC will select a judge to handle the case and set the deadline of the probe within 45 days after the initial investigation.


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