Friday, November 24, 2017
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
Samsung Foundry in Advanced Discussions With New Customers for 7nm Chips
Tesla Finished Installing the World's Largest Mega-battery in Australia Within 100 Days
Apple Applies for Patent on Foldable Display
HP Patches Code execution Bug in Enterprise Printers
YouTube Takes More Steps to Tackle Down Videos Inappropriate for Minors
Broadcom Considering Increasing Qualcomm Bid
Facebook Will Notify you if you Have Followed Russian Propaganda
Russia Threatens to Block Ads on Google
Active Discussions
Which of these DVD media are the best, most durable?
How to back up a PS2 DL game
Copy a protected DVD?
roxio issues with xp pro
Help make DVDInfoPro better with dvdinfomantis!!!
menu making
Optiarc AD-7260S review
cdrw trouble
 Home > News > Mobiles > Samsung...
Last 7 Days News : SU MO TU WE TH FR SA All News

Monday, September 18, 2017
Samsung to Produce Its Own 1,000fps, 3-layer Image Sensor for Smartphones


Samsung has developed and plans to mass produce a 3-layer CMOS image sensor for smartphones, which can shoot slow-motion video at a 1,000 frames per second.

The concept is familiar for those watching the CMOS market, as Sony has already released 3-layer sensors for smarthones and its premium Xperia XZ and XZ1 models: the CMOS has a stacked configuration with a back-illuminated pixel array, a signal processing circuit layer and DRAM. The DRAM used in Sony's sensor is from Micron.

Samsung's CMOS will also have a layered structure - sensor, a logic chip along with Samsung's DRAM memory - using the through-silicon via (TSV) interconnect technique.

Samsung has already ordered the equipment required in order to mass produce the new sensor and plans to start mass production by November.

Image sensors typidally used in current premium Smartphones are based on a 2-layered structure that is composed of a sensor and a logic chip. The image processing required for detecting and tracking of objects has to be carried out at a later stage.

Sony's CMOS features a Micron's DRAM chip placed between an image sensor and a logic chip. The Japanese company has developed a batch process system that attaches a sensor, a DRAM chip, and a logic chip in a single wafer. Samsung's approach will be to use first create a 2-layered structure with a sensor and a logic chip and then attach the DRAM memory using a Thermocompression bonding approach. It is a wafer bonding technique in which two metals are brought into atomic contact applying force and heat simultaneously. The diffusion requires atomic contact between the surfaces due to the atomic motion. The atoms migrate from one crystal lattice to the other one based on crystal lattice vibration. This atomic interaction sticks the interface together.

Obviously, Sony's approach is more productive and cost-efficient, but Samsung has obviously decided to use the TC approach in order to avoid possible patent infringments. On the other hand, Samsung has an advantage over Sony as it will receive the DRAM chips internally.

It is predicted that Samsung's new 3-layered image sensors will be used in the company's next Galaxy Smartphones. Currently, Samsung receives half of the required image sensors from Sony and the other half from its own Semiconductor Business Department.



Previous
Next
Free CCleaner Software Compromised to Open Back-door to Million of PCs        All News        Google Introduces the Tez Mobile Payments and Commerce App in India
Nokia Receives Decision in Patent License Arbitration with LG Electronics     Mobiles News      Google Introduces the Tez Mobile Payments and Commerce App in India

Get RSS feed Easy Print E-Mail this Message

Related News
Sony Releases 7.42 Effective Megapixel Stacked CMOS Image Sensor for Automotive Cameras
Samsung Takes on Sony With New ICOCELL Image Sensors for Smartphones
Samsung Launches ISOCELL Image Sensor Brand
New Sony 20MP CMOS Image Sensor Released
Sony's IMX382 High-Speed Vision Sensor that Tracks Objects at 1,000 fps
Panasonic Develops First Organic CMOS Image Sensor With Electrically Controllable Near-Infrared Light Sensitivity
Sony Develops the First 3-Layer Stacked CMOS Image Sensor with DRAM for Smartphones
SK Hynix to Expand Production Of Image Sensors At New 300mm Factories
Samsung Takes On Sony With Dual Pixel Technology In Its Newest Image Sensor
New Sony 22.5 Megapixel Exmor RS Stacked CMOS Image Sensor Features Built-in Hybrid Autofocus and 3-Axis Electronic Image Stabilization
Sony To Buy CMOS And Memory Controller Manufacturing Fabrication Facilities From Toshiba
Sony To Buy Toshiba's Image Sensor Business: report

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2017 - All rights reserved -
Privacy policy - Contact Us .