Samsung Electronics has added 11-nanometer (nm) FinFET process technology (11LPP, Low Power Plus) to its advanced foundry process portfolio.
Through further scaling from the earlier 14LPP process, 11LPP delivers up to 15 percent higher performance and up to 10 percent chip area reduction with the same power consumption, according to Samsung.
In addition to the 10nm FinFET process for mobile processors in premium flagship smartphones, the company expects its 11nm process to bring differentiated value to mid- to high-end smartphones.
The new process technology is scheduled to be ready for production in the first half of 2018.
Samsung also confirmed that development of 7LPP with EUV (extreme ultra violet) lithography technology is on schedule, targeting its initial production in the second half of 2018.
Since 2014, Samsung has processed close to 200,000 wafers with EUV lithography technology and has recently seen visible results in process development such as achieving 80 percent yield for 256 megabit (Mb) SRAM (static random-access memory).
Details of the recent update to Samsung's foundry roadmap, including 11LPP availability and 7nm EUV development, will be elaborated at the Samsung Foundry Forum Japan on September 15, 2017, in Tokyo.
The chipmaker earlier this year launched a standalone pure-play foundry with ambition to turn on-demand chipmaking business into the world's second largest based on its cutting-edge technology.
Samsung is looking to offer a 8nm process first in the first half of 2018. It is likely a strategy to offer clients a more price-competitive but near level technology as TSMC's 7nm process at the same time.