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Monday, May 29, 2017
Samsung Electronics Is Considering Adding Second 3D NAND Line in China


Samsung Electronics is considering adding 3D NAND memory chip production capacity at its manufacturing base in China following the first established in Xi'an in 2014.

If the plan proceed, the second NAND line in the existing Xi'an facility will likely launch production in 2019.

This move is part of Samsung's strategy to maintain its leadership in the global NAND flash market, in a situation where its rivals SK Hynix and Micron Technology are beefing up investment in this area of business.

Samsung, the world's biggest memory chip maker by sales, has already invested $7 billion in the Xi'an facility to make 3D NAND memory chips.



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