Tuesday, July 28, 2015
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
Qualcomm Enables Wireless Charging for Mobile Devices with Metal Cases
New Memory Memory Chip Is 1,000 Times Faster Than Flash
Motorola Unveils New Moto G, Moto X Play and Moto X Style Android Phones
Hackers Could Break Into Your Android Smartphone With A Simple MMS
Google Relases New Consent Policy in European Union
Samsung To Showcase New Galaxy Phablet on August 13 Event
OnePlus 2 Smarphone Is An Affordable, High-End Flagship
Google Announces Changes To Google Plus
Active Discussions
How to back up a PS2 DL game
Copy a protected DVD?
roxio issues with xp pro
How to burn a backup copy of The Frozen Throne
Help make DVDInfoPro better with dvdinfomantis!!!
Copied dvd's say blank in computer only
menu making
Optiarc AD-7260S review
 Home > News > PC Parts > Samsung...
Last 7 Days News : SU MO TU WE TH FR SA All News

Wednesday, August 27, 2014
Samsung Starts Mass Production Of First 3D TSV DDR4 Modules


Samsung has started mass producing the first 64 gigabyte (GB), double data rate-4 (DDR4), registered dual Inline memory modules (RDIMMs) that use three dimensional (3D) "through silicon via" (TSV) package technology.

The new RDIMMs include 36 DDR4 DRAM chips, each of which consists of four 4-gigabit (Gb) DDR4 DRAM dies. The low-power chips are manufactured using Samsung's most advanced 20-nanometer (nm) class process technology and 3D TSV package technology.

Samsung's has also started producing 3D Vertical NAND (V-NAND) flash memory last year. While 3D V-NAND technology embraces high-rise vertical structures of cell arrays inside a monolithic die, 3D TSV is an innovative packaging technology that vertically interconnects stacked dies.

To build a 3D TSV DRAM package, the DDR4 dies are ground down as thin as a few dozen micrometers, then pierced to contain hundreds of fine holes. They are vertically connected through electrodes that are passed through the holes. As a result, the new 64GB TSV module performs twice as fast as a 64GB module that uses wire bonding packaging, while consuming approximately half the power.

In the future, Samsung believes that it will be able to stack more than four DDR4 dies using its 3D TSV technology, to create even higher density DRAM modules.



Previous
Next
Larger iPad Coming Next Year        All News        HP Recalls Millions Of Power Cords
Larger iPad Coming Next Year     PC Parts News      HP Recalls Millions Of Power Cords

Get RSS feed Easy Print E-Mail this Message

Related News
Samsung To Showcase New Galaxy Phablet on August 13 Event
Smartphone Market Posts Year-Over-Year Growth in Q2 2015
Samsung Unveils New Data Center Solid State Drives
New Galaxy J2 Coming In S. Korea
Samsung Galaxy Tab S2 Tablet Coming Next Month
Samsung Launches The Ultra-slim Galaxy A8 in China
Samsung To Develop 11K Super-Resolution Display
Next Generation Samsung Galaxy Note To Come In August
Samsung Galaxy Grand Prime Arrives At Sprint
Samsung Announces Earnings Guidance
Samsung's s 2TB 850 PRO SSDs Are Rolling Out Globally
South Korean Display Makers To Provide Flexible Display For Next Apple Watch: analyst

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2015 - All rights reserved -
Privacy policy - Contact Us .