Tessera Technologies, Inc. and Micron Technology, Inc.
announced today the execution of new, multi-year technology and patent license agreements.
In addition to the new patent license agreement, Tessera’s wholly
-owned subsidiary Invensas Corporation will license its Multi
-Die Face-Down (xFD) semiconductor packaging technology to Micron and cooperate with Micron on the manufacturing of Micron products that incorporate xFD technology.
As part of the agreements, Tessera and Micron will also explore
other possible joint development efforts.