Monday, February 27, 2017
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
MWC: HP Announces The Pro x2 612 G2 Commercial Detachable
HMD Brings Nokia's Classic 3310 Phone Back
MWC: Samsung Launches The Galaxy Tab S3, Galaxy Book, And New Gear VR With Controller
New Budget-friendly Moto G5 and G5 Plus Come With Metal Designs
DJI Introduces M200 Series Drones For Enterprise Solutions
MWC: ZTE Unveils The'Gigabit' Proof-of-concept Smartphone
MWC: Huawei Launches New HUAWEI P10 and P10+ Smartphones, Watch 2 Smartwatches
Samsung to Showcase Galaxy Tab S3 and Galaxy Book 2 Tablets, A New Gear VR at MWC
Active Discussions
Which of these DVD media are the best, most durable?
How to back up a PS2 DL game
Copy a protected DVD?
roxio issues with xp pro
Help make DVDInfoPro better with dvdinfomantis!!!
menu making
Optiarc AD-7260S review
cdrw trouble
 Home > News > General Computing > Toshiba...
Last 7 Days News : SU MO TU WE TH FR SA All News

Thursday, July 31, 2014
Toshiba, Samsung Vie For 48-layer 3-D NAND Chips


Two of the world's major NAND flash memory chip makers -- Toshiba and Samsung Electronics -- are competing against each another on the development and commercialization of next-generation 3-D memory chips.

NAND flash memory chips are used in smartphones and PCs.

While conventional memory chips basically consist of one layer of memory elements, 3-D chips are made by stacking up dozens of thin layers of memory elements. This multiple-layer method helps expand memory capacity dramatically. Toshiba is aiming to produce NAND memory chips capable of storing 1 terabyte of data by fiscal 2019.

The more layers 3-D memory chips have, the larger their memory storage capacity will become. Both companies have yet to disclose their developmental status, but unconfirmed reports claim that they have achieved 24 layers last year and are expecting to develop 32-layered memory chips this year.

Thought 3D chips are still in the developmental stage, industry experts point out that conventional two-dimensional memory chips still offer more advantages at present. Observers say that both Toshiba and Samsung are looking to achieve 48 layers in 2015 and are now rushing to turn out truly next-generational memory products ahead of their main competitor.



Previous
Next
AMD Introduces New Kaveri APUs for System Builders        All News        Sony Reports First Quarter Profit
Lite-On IT Merged With Lite-On     General Computing News      Sony Reports First Quarter Profit

Get RSS feed Easy Print E-Mail this Message

Related News
Toshiba Starts Sampling 64-Layer, 512-gigabit 3D Flash Memory
Micron's 2017 Roadmap Includes 64-layer 3D NAND And GDDR6
A Closer Look At SK Hynix's 3D NAND
SK hynix To Start Mass Production Of 48-layer 3D-NAND Chips
Toshiba Expands 3D Flash Memory Production Capacity In New Fabrication Facility at Yokkaichi
Samsung to Start Making 64-layer 3-D Flash memory for Smartphones
Toshiba Announces New BG SSDs with 3-Bit-Per-Cell TLC BiCS FLASH
Western Digital Announces First 64 Layer 3D NAND Technology
Toshiba To Produce First 64-layer 3D NAND Flash Memory Chip
China To Invest In 3D NAND Flash Plant
3D NAND-Flash Memory Makers Invest n New Facilities
SK Hynix Starts Mass Production Of 3D NAND Memory

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2017 - All rights reserved -
Privacy policy - Contact Us .