Saturday, September 20, 2014
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
Android L To Support Encryption By Default
Microsoft Outlines Basic Elements Of Direct3D 12
New GeForce WHQL Driver Released
Panasonic and Leica Expand Partnership Agreement
Acer Brings 4K2K Displays With NVIDIA G-SYNC to The US
Order Your Samsung Galaxy Note 4 Today
TSMC Acquires EUV Machines For 10nm Chips
Atmos Firmware Update for Pioneer Elite SC Receivers Coming this Month
Active Discussions
Yamaha CRW-F1UX
help questions structure DVDR
Made video, won't play back easily
Questions durability monitor LCD
Questions fungus CD/DVD Media, Some expert engineer in optical media can help me?
CD, DVD and Blu-ray burning for Android in development
IBM supercharges Power servers with graphics chips
Werner Vogels: four cloud computing trends for 2014
 Home > News > PC Parts > Intel O...
Last 7 Days News : SU MO TU WE TH FR SA All News

Thursday, April 03, 2014
Intel Outlines New USB 3.1 Type-C Connectors, Braswell Chip at IDF 2014


Intel is preparing a new 14nm "Braswell" SoC to succeed its Bay Trail processor for affordable Chrome OS and Android devices. In addition, the company talked about the forthcoming USB Type-C cable for small form-factor platforms at IDF Shenzhen, China.

Intel did not provide many details on the 14nm successor to its budget 22nm Bay Trail processors. Dubbed Braswell, this new SoC architecture is mainly aimed at the likes of affordable Chrome OS, Android devices, entry-level desktops, notebooks and convertibles. Intel says that is is working on bringing over 20 Chromebook designs to the market this year.

Braswell is expected to offer better performance and power efficiency than the Bay Trail chips used in today's value-segment PCs and tablets.

Intel is also updating its Bay Trail chips for tablets by reducing the components and the cost of the processors. In this year's second half, the company will add performance upgrades to Bay Trail, including better graphics, and more security features.

Intel also talked about the next generation of USB connector, dubbed USB Type-C connector.

Built initially on existing USB 3.1 (10Gbps) and USB 2.0 technologies, USB Type-C is being developed to help enable thinner and sleeker product designs.

Key characteristics of the USB Type-C connector and cable solution include a new design tailored to work well with emerging product designs; a similar in size to the existing USB 2.0 Micro-B; usability enhancements - users will no longer need to be concerned with plug orientation/cable direction; support for scalable power charging and; scalability - the connector design will scale for future USB bus performance.



As the new USB Type-C plug and receptacle will not directly mate with existing USB plugs and receptacles (Type-A, Type-B, Micro-B, etc.), the Type-C specification will define passive new-to-existing cables and adapters to allow users to use their existing products.

The USB Type-C connector has an opening of ~ 8.3 x 2.5mm. Its durability is 10,000 cycles and has improved EMI and RFI mitigation features. Its power deilivery capacity will be 3A for standard cables and 5A for the connectors.

The USB Type-C specification is expected to be published by the middle of 2014.

In addition, Intel said that the USB 3.1 protocol will be used for transfering audio and video. Dubbed USB AV, it could e used to replace all the video and audio connectors and cables, for battery charging, enables bi-directional transfer controll and simultaneous streaming. ANd compared to HDMI, the USb cabes are cheaper.

In terms of bandwidth, USB AV 3.1 has the same bandwidth as HDMI 1.4 (10.2 Gbps), meaning it it supports 4K/30p and also packs HDCP.




Previous
Next
Fujitsu Launches New GS21 Series Mainframes Featuring New Processors        All News        Dell Introduces Latitude Rugged Extreme Lineup
Fujitsu Launches New GS21 Series Mainframes Featuring New Processors     PC Parts News      Dell Introduces Latitude Rugged Extreme Lineup

Get RSS feed Easy Print E-Mail this Message

Related News
Latest Intel LTE Chipset Certified on China Mobile
Intel Offers Developers Software Tools, Outlines PC Evolution Across New Form Factors
Intel Unveils New Developer Tools, Future Technologies Tablets, Analytics, Wearable Devices and PCs at IDF 2014
New Intel Xeon E5-2600 v3 Processors Released
Intel Turns To Fashionable Wearables With Collaboration With Fossil Group
New Intel Core M Processor Coming In Tablets, Hybrids
Latest Intel Graphics Driver Update Boosts Performance
Opening Ceremony and Intel Reveal MICA Accessory
Intel Hopes To Improve Its Mobile Business With Ex-Qualcomm exec
Intel Unleashes its First 8-Core Desktop Processor For Gaming
Intel Introduces World's Smallest Standalone 3G Modem
Intel Highlights Its Wireless Computing Plans

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2014 - All rights reserved -
Privacy policy - Contact Us .