Tuesday, January 23, 2018
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
Intel: Stop Installing Security Patches Until Further Notice
Microsoft Takes On Chromebooks With Education Windows 10 Devices starting at $189
Opera Mobile Browsers Introduce Bitcoin Mining Protection
Amazon Store Let's You Walk Away Without Checking out
Facebook Admits it Could Harm Democracy
Facebook to Open Digital Training Hubs in Europe
U.S. ITC to Probe Samsung, SK Hynix, Lenovo Over SSDs
LG Won't Showcase New G Series Smartphone at MWC
Active Discussions
Which of these DVD media are the best, most durable?
How to back up a PS2 DL game
Copy a protected DVD?
roxio issues with xp pro
Help make DVDInfoPro better with dvdinfomantis!!!
menu making
Optiarc AD-7260S review
cdrw trouble
 Home > News > Mobiles > Toshiba...
Last 7 Days News : SU MO TU WE TH FR SA All News

Monday, March 03, 2014
Toshiba Develops TransferJet-Compatible 3D-Integrated Ultra-Small Module


Toshiba has developed a very small wireless communication module and a thin flexible printed circuit (FPC) coupler compatible with TransferJet, the close-proximity wireless transfer technology.

In combination and applied to mobile devices, such as smartphones, they achieve a maximum data transfer rate of 375Mbps.

TransferJet is a low-power, high-speed communication standard, and is expected to find acceptance because of its simple approach to allows high-speed communications between electronic devices in close proximity.

Toshiba's small module, only 4.8mm x 4.8mm x 1.0mm, and ultra-thin FPC coupler, only 0.12mm thick, achieve a maximum physical layer transmission rate of 522Mbps (effective data transfer rate of 375Mbps). Module miniaturization was realized by employing 3D integration technology to embed a TransferJet-compatible LSI in the module substrate.

A potential problem with small, thin modules formed with 3D integration technology is a parasitic capacitance increase that often degrades performance. The frequency response of TransferJet is particularly sensitive to this, as has a wide signal bandwidth, 560MHz. Toshiba solved these potential problems with the design of the module structure and tuning transmission signals? waveforms inside the LSI.

The new FPC coupler is fabricated with molecular bonding technology, which secures enough adhesion of FPC by covalent bond of a thin molecular layer. The coupler is electrically evaluated with the module and Toshiba says excellent transmission RF signals have been observed. It has quarter thickness of conventional couplers.

The module is now ready for sample production and the coupler will be ready for sample production this month.




Previous
Next
Chinese Windows XP Users To Get Security Support After April 8        All News        Android Led Tablet Sales In 2013
Google, Samsung Concerned About Microsoft-Nokia deal: report     Mobiles News      Apple Rolls Out CarPlay Giving Drivers iPhone Voice Control Options

Get RSS feed Easy Print E-Mail this Message

Related News
Toshiba Reveals Fresh Canvio Portable Hard Drive Models
Toshiba Officially Unveils Mainstream RC100 NVMe SSD Series
Struggling Toshiba Sells Westinghouse to Brookfield
Toshiba Introduces the Symbio Smart Home Solution With Alexa Support
Toshiba to Unveil New RC100 NVMe and Portable XS700 SSDs at CES 2018
Toshiba to Prepare New Semiconductor Fabrication Facility
Toshiba Introduces New AL15SE 10,500rpm Enterprise Performance HDD
Toshiba and Western Digital Reach Settlement, Agree to Strengthen Flash Memory Collaboration
Toshiba and Western Digital Close to Agreement Over Memory Chip Sale
Toshiba Moving Closer to Deal With Western Digital
Toshiba Launches First 14TB HDD with Conventional Magnetic Recording
Toshiba Releases 10TB NAS-Class Hard Drive

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2018 - All rights reserved -
Privacy policy - Contact Us .