Wednesday, June 28, 2017
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
Samsung to Open $380 Million Home Appliance Manufacturing Plant in South Carolina
Dolby Atmos Coming to Netflix
Toshiba Delays Chip Unit Deal, Sues Western Digital
Qualcomm Debuts the Snapdragon Wear 1200 and the Snapdragon 450 Mobile Platforms
Samsung Launches ISOCELL Image Sensor Brand
Toshiba Announces 96-Layer 3D Flash Memory and 64-Layer QLC 3D Flash Memory
Western Digital Announces First 96-Layer 3D NAND Technology
New Intel SSD 545s Packs 64-layer 3D TLC Flash
Active Discussions
Which of these DVD media are the best, most durable?
How to back up a PS2 DL game
Copy a protected DVD?
roxio issues with xp pro
Help make DVDInfoPro better with dvdinfomantis!!!
menu making
Optiarc AD-7260S review
cdrw trouble
 Home > News > PC Parts > Rambus ...
Last 7 Days News : SU MO TU WE TH FR SA All News

Tuesday, December 10, 2013
Rambus Settles Patent Disputes With Micron


Rambus said Monday that it had signed a patent cross-license agreement with Micron Technology, giving Micron the right to use any Rambus patent to make specified integrated circuit products, including memory.

However, Micron will pay a license fee to Rambus for certain of these memory products after the end of the initial term. The agreement requires quarterly royalty payments to Rambus over the next seven years capped at $10 million per quarter, with a rolling twelve-month cap fixed at $40 million, or $280 million during the initial term. In addition, Micron will have the option to extend the initial term of this agreement for additional renewal periods.

As part of this agreement, the two companies have also settled all outstanding patent and antitrust claims, and the agreement covers both Micron and Elpida products.

The companies did not disclose other terms and details of the agreement.

"This milestone agreement puts years of legal disputes behind both companies and opens doors for future cooperation," said Dr. Ron Black, president and chief executive officer at Rambus. "We continue to focus on developing innovative technology and furthering our more open, collaborative relationship with the broader industry."

"The industry is at an important juncture with the emergence of memory systems and solutions, and Micron is ideally positioned to capitalize on this trend," said Micron CEO Mark Durcan.

Rambus also settled in June with SK Hynix for a $240 million patent licensing agreement, ending a nearly 13-year patent dispute between the two companies over memory-chip technology. Rambus and STMicroelectronics announced soon after that they had reached a new agreement, which would settle outstanding claims and expand existing licenses.

Seperately, Micron today announced the availability of 45nm Serial NOR Flash memory samples in 512Mb, 1Gb, and 2Gb densities with a standard SPI interface.

These new MT25Q SPI NOR devices offer drop-in compatibility with legacy NOR devices, enabling high-density SPI NOR adoption in consumer, automotive, industrial and networking applications.

Micron's MT25Q devices satisfy embedded application requirements with 2 MB/s programming speed. In addition, MT25Q devices offer improved erase performance and 66 MB/s read performance, enabling fast updates and boot performance for embedded systems. The MT25Q family also offers the first serial NOR 2Gb device in a 6mm x 8mm BGA package, which is the smallest package available in the market today.

Micron is offering samples of the MT25Q devices in BGA and SO16W packages.




Previous
Next
AllSeen Alliance Established To Advance The Smart House        All News        Toshiba Announces Enterprise Read Intensive SSD for Servers
HP Updates Commercial PC line, Reveals Thin Client With Quad-Core Processors     PC Parts News      Toshiba Announces Enterprise Read Intensive SSD for Servers

Get RSS feed Easy Print E-Mail this Message

Related News
Micron Lexar Removable Storage Retail Business Discontinued
Crucial BX300 SSD Coming This Summer
Micron's GDDR5X Memory Hits the 16Gbps, Mass Production of GDDR6 on Track For Next Year
SK Hynix and Micron Try To Catch up With Samsung in 10nm DRAM Production
Micron Announces a 4-server-node, All-flash, Accelerated Ceph Storage Solution
Micron Unleashes the Power of NVMe Storage, With New SolidScale System
Micron Says Former Employees Gave Away DRAM Technologies To Chinese Competitors
Micron's 1xnm DRAM Process Has Low Yields, Says Report
Micron's Revenue Increased Due To Strong Memory Chip Sales
Micron Establishes New Back-end Site DRAM in Taiwan
Rambus Introduces 14nm High Bandwidth Memory PHY For Data Centers
Micron's 2017 Roadmap Includes 64-layer 3D NAND And GDDR6

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2017 - All rights reserved -
Privacy policy - Contact Us .