Sunday, April 26, 2015
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
Russian Hackers Accessed Obama's Emails
LG Display Leads The OLED Market
China Telecom To Sell Phones With Alibaba
SK Hynix To Start Production Of 36-Layer 3D NAND Flash Chips
Apple Watch Available In Select Stores
Comcast Abandons Time Warner Cable Acquisition Bid
Luxottica To Release Hi-tech Glasses Powered By Intel
Toshiba Starts Mass Production of 13 Megapixel CMOS Image Sensor
Active Discussions
menu making
roxio issues with xp pro
How to burn a backup copy of The Frozen Throne
Help make DVDInfoPro better with dvdinfomantis!!!
Question about nero
Copied dvd's say blank in computer only
Optiarc AD-7260S review
cdrw trouble
 Home > News > General Computing > Toshiba...
Last 7 Days News : SU MO TU WE TH FR SA All News

Tuesday, July 02, 2013
Toshiba And Sandisk Expand Semiconductor Fabrication Facility


Toshiba ans Sandisk will expand their No. 5 semiconductor joint venture wafer fabrication facility (Fab 5) at Yokkaichi Operations in Mie, Japan, to secure manufacturing space for NAND flash memories fabricated with next generation process technology and for future 3D memories.

Fab 5 second phase construction will start at the end of August this year and be completed in summer next year.

The companies expect to use phase two of Fab 5 primarily for technology transitions of existing Yokkaichi wafer capacity. The new cleanroom will provide the space needed for additional equipment required for transitioning the wafer capacity in Fab 3, Fab 4 and phase one of Fab 5, to next generation 2D NAND technologies and to early generations of 3D NAND technology.



Fab 5 will have an earthquake absorbing structure and is designed to minimize environmental impact. Extensive use of LED lighting throughout the facility and up-to-date energy-saving production facilities, along with full and effective use of waste heat, are expected to reduce CO2 emissions to a level 13 percent lower than for Fab 4.

Fab 5 phase 2 will have an automated product transportation system and quake-absorbing structure and will be designed to minimize environmental loads. Deployment of LED lighting and up-to-date energy-saving production facilities, along with full and effective use of waste heat, are expected to cut CO2 emissions by 13% compared with Fab 4.


Previous
Next
Apple Applies iWatch Trademark Filings in Taiwan, Mexico        All News        Sharp to Introduce 4K Touchscreen LCD Monitor
DivX HEVC Decoder Released     General Computing News      Microsoft to Retire TechNet Subscription Service

Get RSS feed Easy Print E-Mail this Message

Related News
SK Hynix To Start Production Of 36-Layer 3D NAND Flash Chips
Toshiba Starts Mass Production of 13 Megapixel CMOS Image Sensor
SanDisk Forecasts Full-year Revenue Decline
Toshiba Announces the Portégé R30 laptop
Toshiba's Image Processing Technology Provides Image Quality on Par with Larger Sensors
Micron and Intel Unveil New 3D NAND Flash Memory
Toshiba, Sandisk, Develop First 48-layer 3D NAND For SSDs
Toshiba Expands Line-up of eMMC Version 5.1 Embedded NAND Flash Memory Products
Toshiba Starts Production of 13-Megapixel CMOS Image Sensor With "Bright Mode" Video Technology
Toshiba Expands Internal and External Desktop Hard Drive Lineup With New 6TB Models
Samsung Strengthens Its SSD Business With New Apple Macbook Deal
Toshiba Debuts 12.0 Gbps SAS HDD

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2015 - All rights reserved -
Privacy policy - Contact Us .