Saturday, October 01, 2016
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
LG Curved OLEDs Not Ready For The G6 Smartphone: report
Google Faces Fine Over Anti-competitive Android Practices: report
Hackers Probed Voting Systems, U.S. Says
Apple Ows $302.4 million to VirnetX, Court Rules
California Proposes Law That Would Require No Human Presence In Self-driving Cars
Shuttle Releases New Palm-sized and 4K Ultra Slim PC-NC02U Series
Nintendo NES Classic Edition Launches In November, NX Could be Announced Earlier
Foxconn's Sharp to Invest $570 Million on Flexible OLED Panel Production
Active Discussions
Which of these DVD media are the best, most durable?
How to back up a PS2 DL game
Copy a protected DVD?
roxio issues with xp pro
Help make DVDInfoPro better with dvdinfomantis!!!
menu making
Optiarc AD-7260S review
cdrw trouble
 Home > News > General Computing > Toshiba...
Last 7 Days News : SU MO TU WE TH FR SA All News

Tuesday, July 02, 2013
Toshiba And Sandisk Expand Semiconductor Fabrication Facility


Toshiba ans Sandisk will expand their No. 5 semiconductor joint venture wafer fabrication facility (Fab 5) at Yokkaichi Operations in Mie, Japan, to secure manufacturing space for NAND flash memories fabricated with next generation process technology and for future 3D memories.

Fab 5 second phase construction will start at the end of August this year and be completed in summer next year.

The companies expect to use phase two of Fab 5 primarily for technology transitions of existing Yokkaichi wafer capacity. The new cleanroom will provide the space needed for additional equipment required for transitioning the wafer capacity in Fab 3, Fab 4 and phase one of Fab 5, to next generation 2D NAND technologies and to early generations of 3D NAND technology.



Fab 5 will have an earthquake absorbing structure and is designed to minimize environmental impact. Extensive use of LED lighting throughout the facility and up-to-date energy-saving production facilities, along with full and effective use of waste heat, are expected to reduce CO2 emissions to a level 13 percent lower than for Fab 4.

Fab 5 phase 2 will have an automated product transportation system and quake-absorbing structure and will be designed to minimize environmental loads. Deployment of LED lighting and up-to-date energy-saving production facilities, along with full and effective use of waste heat, are expected to cut CO2 emissions by 13% compared with Fab 4.


Previous
Next
Apple Applies iWatch Trademark Filings in Taiwan, Mexico        All News        Sharp to Introduce 4K Touchscreen LCD Monitor
DivX HEVC Decoder Released     General Computing News      Microsoft to Retire TechNet Subscription Service

Get RSS feed Easy Print E-Mail this Message

Related News
Toshiba, Tohoku Electric and Iwatani Start Study of World?s Largest Hydrogen Energy System
Toshiba Introduces the Value-oriented OCZ TL100 SATA SSD Series
SanDisk Unveils 1TB Prototype SDXC Card
Toshiba Expands 24nm SLC Flash Family with 16Gb Offering
Toshiba Introduces the OCZ VX500 SATA SSD Series
Toshiba to Implement Eyefi Connected Features in Next FlashAir SD Cards
Micron Announces QuantX Branding For 3D XPoint Memory, Releases 3D NAND flash for Mobile Devices
Toshiba Debuts Flashmatrix Technology
Toshiba Announces New BG SSDs with 3-Bit-Per-Cell TLC BiCS FLASH
Toshiba's ZD6000 Dual Port NVMe SSD Offers A Capacity Of 7.68TB
Western Digital Announces First 64 Layer 3D NAND Technology
Toshiba To Produce First 64-layer 3D NAND Flash Memory Chip

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2016 - All rights reserved -
Privacy policy - Contact Us .