Tuesday, March 28, 2017
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
Google Assistant Is Coming To More Connected Devices
Self-assembly Technique Could Solve Miniaturization Chip Making Issues
Prepare For Battle GeForce GTX Bundle Includes For Honor or Tom Clancy's Ghost Recon Wildlands Games
VIZIO's 2017 D-Series Smart TV Collection Includes 4K Ultra HD Support in Select Models
Facebook Attacks Snapchat With New Camera Features
China Tech Giant Tencent Buys 5 Percent Stake In Tesla
Hyundai Motor To Develop Its Own Automotive Chips
Razer "Paid to Play" Initiative to Reward Fans for Playing Games
Active Discussions
Which of these DVD media are the best, most durable?
How to back up a PS2 DL game
Copy a protected DVD?
roxio issues with xp pro
Help make DVDInfoPro better with dvdinfomantis!!!
menu making
Optiarc AD-7260S review
cdrw trouble
 Home > News > General Computing > Toshiba...
Last 7 Days News : SU MO TU WE TH FR SA All News

Tuesday, July 02, 2013
Toshiba And Sandisk Expand Semiconductor Fabrication Facility


Toshiba ans Sandisk will expand their No. 5 semiconductor joint venture wafer fabrication facility (Fab 5) at Yokkaichi Operations in Mie, Japan, to secure manufacturing space for NAND flash memories fabricated with next generation process technology and for future 3D memories.

Fab 5 second phase construction will start at the end of August this year and be completed in summer next year.

The companies expect to use phase two of Fab 5 primarily for technology transitions of existing Yokkaichi wafer capacity. The new cleanroom will provide the space needed for additional equipment required for transitioning the wafer capacity in Fab 3, Fab 4 and phase one of Fab 5, to next generation 2D NAND technologies and to early generations of 3D NAND technology.



Fab 5 will have an earthquake absorbing structure and is designed to minimize environmental impact. Extensive use of LED lighting throughout the facility and up-to-date energy-saving production facilities, along with full and effective use of waste heat, are expected to reduce CO2 emissions to a level 13 percent lower than for Fab 4.

Fab 5 phase 2 will have an automated product transportation system and quake-absorbing structure and will be designed to minimize environmental loads. Deployment of LED lighting and up-to-date energy-saving production facilities, along with full and effective use of waste heat, are expected to cut CO2 emissions by 13% compared with Fab 4.


Previous
Next
Apple Applies iWatch Trademark Filings in Taiwan, Mexico        All News        Sharp to Introduce 4K Touchscreen LCD Monitor
DivX HEVC Decoder Released     General Computing News      Microsoft to Retire TechNet Subscription Service

Get RSS feed Easy Print E-Mail this Message

Related News
Toshiba Delays Earnings Report, Announces Recovery Plan
Toshiba Informs SK hynix of New Plan to Sell Memory Business
Foxconn Is Bidding for Toshiba Chip Business
Western Digital Releases New iNAND 7350 Storage Solution Built on 3D NAND
Toshiba Starts Sampling 64-Layer, 512-gigabit 3D Flash Memory
Toshiba Books $6.3 Billion Writedown, Chairman Resigns
Toshiba Starts Construction of Fab 6 at Yokkaichi, Japan
Toshiba Announces First MN Series HDDs
HGST Introduces The Skyhawk NVMe-compliant PCIe SSDs
SK hynix Bids for Stake in Toshiba's Memory Chip Business
Western Digital Introduces First 512 Gigabit 64-Layer 3D NAND Chip
Micron's 2017 Roadmap Includes 64-layer 3D NAND And GDDR6

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2017 - All rights reserved -
Privacy policy - Contact Us .