ARM and TSMC today announced the first tape-out of ARM's highest performing processor, the ARM Cortex-A57, on FinFET process technology.
The Cortex-A57 processor has been designed to extend the capabilities of future mobile and enterprise computing, including compute intensive applications such as high-end computer, tablet and server products. This is the first milestone in the collaboration between ARM and TSMC to jointly optimize the 64-bit ARMv8 processor series on TSMC FinFET process technologies. The two companies cooperated in the implementation from RTL to tape-out in six months using ARM Artisan physical IP, TSMC memory macros, and EDA technologies enabled by TSMC's Open Innovation Platform (OIP) design ecosystem.
"This first ARM Cortex-A57 processor implementation paves the way for our mutual customers to leverage the performance and power efficiency of 16nm FinFET technology," said Tom Cronk, executive vice president and general manager, Processor Division, ARM. "The joint effort of ARM, TSMC, and TSMC's OIP design ecosystem partners demonstrates the strong commitment to provide industry-leading technology for customer designs to benefit from our latest 64-bit ARMv8 architecture, big.LITTLE processing and ARM POP IP across a wide variety of market segments."
"Our multi-year, multi-node collaboration with ARM continues to deliver advanced technologies to enable market-leading SoCs across mobile, server, and enterprise infrastructure applications," said Dr. Cliff Hou, TSMC Vice President of R&D. "This achievement demonstrates that the next-generation ARMv8 processor is FinFET-ready for TSMC's advanced technology."
The test chip was implemented using a commercially available 16nm FinFET tool chain and design services provided by the OIP ecosystem and ARM Connected Community partners.