Sunday, February 01, 2015
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
South Korea's Antitrust Authority Aims At Google, Apple
Bill Gates Sees Future In Robots
Pirate Bay Back Online
ASUS Announces The B85M-Gamer Mainboard
AT&T, Verizon Among Winners Of US Airwaves Auction
Apple Closes the Gap on Samsung Fourth Quarter's Worldwide Smartphone Shipments
Verizon To Let USers Opt Out Supercookies
Microsoft Outlines Windows 10 Options For The Enterprise
Active Discussions
Why Double Logins ?
retrieving burned cd information
Writing Audio files on DVDs ?
Need major help with Gigabeat
New match-3 puzzle game launch now!
Rimage 2000i
Sound card for my Laptop
hello
 Home > News > PC Parts > ARM and...
Last 7 Days News : SU MO TU WE TH FR SA All News

Friday, December 21, 2012
ARM and Cadence Tape Out First 14nm FinFET Test Chip Targeting Samsung Process


ARM and Cadence Design Systems, Inc. today announced the tape-out of the first 14-nanometer test chip implementation of the energy-efficient ARM Cortex-A7 processor.

Designed with a complete Cadence RTL-to-signoff flow, the chip is the first to target Samsung's 14-nanometer FinFET process, accelerating the continuing move to high-density, high-performance and ultra-low power SoCs for future smartphones, tablets and all other advanced mobile devices.

In addition to the ARM Cortex-A7 processor, the test chip includes ARM Artisan standard-cell libraries, next-generation memories, and general purpose IOs. The test chip was designed using a complete Cadence RTL-to-signoff flow including Encounter RTL Compiler, Encounter Test, Encounter Digital Implementation System, Cadence QRC Extraction, Encounter Timing System and Encounter Power System. This achievement is part of a systematic program to enable ARM technology-based SoCs on FinFET technology.

"This is an important milestone in our efforts to enable our silicon partners for continued low-power leadership in future generations of innovative, energy-efficient mobile products," said Dr. Dipesh Patel, vice president and general manager, Physical IP Division at ARM. "Taping out ARMs most energy-efficient applications processor on Samsungs advanced low-power manufacturing process was achieved through the combination of leading-edge technology and R&D excellence, as well as a deep and early collaboration with Samsung and Cadence."

"End consumers are driving the need for better, faster, more connected devices," said Dr. Kyu-Myung Choi, senior vice president of System LSI infrastructure design center, Device Solutions, Samsung Electronics. "Our collaboration with ARM and Cadence allows us to innovate quickly as Samsung develops this new process technology for mobile multimedia applications."

Samsung also worked with Synopsys for the successful tapeout of the first test chip on Samsung's 14LPE process.

"FinFET transistors can deliver lower power consumption and higher device performance, but they also bring tough challenges," said Dr. Kyu-Myung Choi , vice president of System LSI infrastructure design center, Device Solutions, Samsung Electronics. "We chose Synopsys as our FinFET collaboration partner to solve these challenges, because of our successful history together at 20 nanometer and other nodes. We continue to pool our expertise to deliver innovative FinFET solutions."

Synopsys worked with Samsung to develop a test chip that validates Samsung's advanced 14-nm FinFET process as well as Synopsys' DesignWare Embedded Memories using Synopsys' Self-Test and Repair (STAR) Memory System solution. The test chip will enable the correlation of the simulation models to the FinFET process and contains test structures, standard cells, a PLL and embedded SRAMs. The memory instances include high-density SRAMs designed to operate at very low voltages and high-speed SRAMs to validate the process performance.


Previous
Next
RIM Posts Loss; Settles Patent Dispute With Nokia        All News        Blu-ray 3-D Comes of Age in US Market
AsusTek Downplays Intel's Rumored Switch On Non-socketed CPU Designs     PC Parts News      Foxconn Buys Stake in GoPro

Get RSS feed Easy Print E-Mail this Message

Related News
Apple Closes the Gap on Samsung Fourth Quarter's Worldwide Smartphone Shipments
Samsung Reports Weak Q4 Results
Apple Takes Top Spot in China's Smartphone Market
Samsung Advances Smart eMBMS Solution with Improved Video
Samsung Engineers Develop Wearable Sensor for Stroke Detection
Samsung and Apple Together Consumed 17 Percent of Total Semiconductor Demand in 2014
Samsung Drops Qualcomm 810 Processors in next Galaxy S Due To Overheating: report
Samsung Led The Smartphone Market in 2014, TrendForce Reports
Galaxy S6 Expected to Have Displays On Both Edges
Samsung Starts Mass Production Of 8-Gigabit Graphics DRAM
Samsung, Blackberry Deny Deal Report
Samsung Made A Bid For BlackBerry: report

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2015 - All rights reserved -
Privacy policy - Contact Us .