Friday, October 31, 2014
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
Updated BBM Offers More Privacy, Control and More
Panasonic Raises Profit Outlook
Toshiba Offers New 4TB and 5TB Desktop HDDs
Samsung Introduces New Ultra Slim Galaxy A5 and Galaxy A3 Smartphones For The Chinese Market
Sharp 2Q Profit Slides
PlayStation 4 Sales Sustain Sony's Quarterly Loss
MSI Debuts The GT80 Titan Gaming Notebook With Mechanical Keyboard
Sharp To Produce New Backlight-free LCD Panel For Wearables
Active Discussions
DVD/DL for Optiarc 7191S at 8X
Copied dvd's say blank in computer only
Made video, won't play back easily
New Features In Firefox 33
updated tests for dvd and cd burners
How to generate lots of different CDs quickly
Yamaha CRW-F1UX
help questions structure DVDR
 Home > News > PC Parts > Notable...
Last 7 Days News : SU MO TU WE TH FR SA All News

Tuesday, November 20, 2012
Notable Papers at ISSCC 2013


Samsung, Intel And Nvidia will be among the companies who will present papers at the 2013 IEEE International Solid-State Circuits Conference (ISSCC).

Starting with Samsung, the S. Korean company will present a paper entitled "28nm High-κ Metal-Gate Heterogeneous Quad-Core CPUs for High-Performance and Energy-Efficient Mobile Application Processor."

Samsung's paper described a SoC with two quad-core clusters - an 1.8 GHz cluster geared for high performance apps and a second one running at 1.2 GHz and is tuned for energy efficiency. The new SOC is probably Samsung's implementation of ARM's big.little architecture.

Intel will not describe its upcoming 22-nm Haswell processor or any other processors at ISSCC. The company will present a scalable 64-lane chip-to-chip interconnect with 1 Tbit/s aggregate bandwidth. The link uses multiple 2-16 Gbit/s channels running at power efficiencies of 0.8 to 2.6 pJ/bit in 32nm CMOS with a total bus-level power consumption of 2.6 W. (Paper: Scalable 0.128-to-1Tb/s 0.8-to-2.6pJ/b 64-Lane Parallel I/O in 32nm CMOS.)

Nvidia will not talk directly about the Project Denver SoC. However, the company will describe a 20 Gbit/s serial die-to-die link made in 28-nm CMOS. The link runs on a 0.9 V supply and has power efficiency of 0.54pJ/b. This one could be part of Project Denver SoC, which will include both ARM and graphics cores and will power a wide range of products. (Paper: A 0.54pJ/b 20Gb/s Ground-Referenced Single-Ended Short-Haul Serial Link in 28nm CMOS for Advanced Packaging Applications)

Another interesting paper will be presented by China's Institute of Computing Technology, describing a new version of the China-made Godson 3B processor. The 8-core processor is a 32-nm high-K, metal gate part delivering 172.8 Gflops when running at 1.35 GHz at 40W. (Paper: Godson-3B1500: A 32nm 1.35GHz 40W 172.8GFLOPS 8-Core Processor)

Renesas will describe a 28nm High- Metal-Gate communications SoC with an 1.5GHz dual-core application processor and an LTE/HSPA+-capable baseband processor

Texas Instruments and MIT will describe a 200-MHz video decoder implementing the High-Efficiency Video Coding (HEVC) draft standard to deliver 249 Mpixels/s.

AMD, IBM and Oracle will present papers on their Jaguar (Paper: Jaguar: A Next-Generation Low-Power x86-64 Core,) zSeries (Paper: 5.5GHz System z Microprocessor and Multichip Module) and Sparc T5 processors (Paper: A 3.6GHz 16-Core SPARC SoC Processor in 28nm.)

For more information, read the ISSCC 2013 advance program


Previous
Next
AOC Goes Borderless With New 23-inch IPS Monitor        All News        Latest Firefox Integrates Facebook
AOC Goes Borderless With New 23-inch IPS Monitor     PC Parts News      Skype For Android Tablets Released

Get RSS feed Easy Print E-Mail this Message

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2014 - All rights reserved -
Privacy policy - Contact Us .