Friday, September 04, 2015
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
Updated Google Street View App Has 360-degree Images
Samsung Seeks Piece of Nascent Smartwatch Market With New Gear S2 Smartwatch
Ricoh Unveils Upgraded THETA S Spherical Camera
Barnes & Noble and Samsung Unveil New Samsung Galaxy Tab S2 NOOK
Sony Is Entering The Pico Projector Market
Intel Media Server Studio 2016 Enables Faster Video Transcoding and Transition to HEVC and 4K
JBL Expands Aftermarket Subwoofer Line-up, Promises Big Concert Sound From New Portable Bluetooth Speaker
AMD To Showcase Broadcast Ecosystem Workflows at IBC 2015
Active Discussions
How to back up a PS2 DL game
Copy a protected DVD?
roxio issues with xp pro
How to burn a backup copy of The Frozen Throne
Help make DVDInfoPro better with dvdinfomantis!!!
Copied dvd's say blank in computer only
menu making
Optiarc AD-7260S review
 Home > News > PC Parts > Notable...
Last 7 Days News : SU MO TU WE TH FR SA All News

Tuesday, November 20, 2012
Notable Papers at ISSCC 2013


Samsung, Intel And Nvidia will be among the companies who will present papers at the 2013 IEEE International Solid-State Circuits Conference (ISSCC).

Starting with Samsung, the S. Korean company will present a paper entitled "28nm High-κ Metal-Gate Heterogeneous Quad-Core CPUs for High-Performance and Energy-Efficient Mobile Application Processor."

Samsung's paper described a SoC with two quad-core clusters - an 1.8 GHz cluster geared for high performance apps and a second one running at 1.2 GHz and is tuned for energy efficiency. The new SOC is probably Samsung's implementation of ARM's big.little architecture.

Intel will not describe its upcoming 22-nm Haswell processor or any other processors at ISSCC. The company will present a scalable 64-lane chip-to-chip interconnect with 1 Tbit/s aggregate bandwidth. The link uses multiple 2-16 Gbit/s channels running at power efficiencies of 0.8 to 2.6 pJ/bit in 32nm CMOS with a total bus-level power consumption of 2.6 W. (Paper: Scalable 0.128-to-1Tb/s 0.8-to-2.6pJ/b 64-Lane Parallel I/O in 32nm CMOS.)

Nvidia will not talk directly about the Project Denver SoC. However, the company will describe a 20 Gbit/s serial die-to-die link made in 28-nm CMOS. The link runs on a 0.9 V supply and has power efficiency of 0.54pJ/b. This one could be part of Project Denver SoC, which will include both ARM and graphics cores and will power a wide range of products. (Paper: A 0.54pJ/b 20Gb/s Ground-Referenced Single-Ended Short-Haul Serial Link in 28nm CMOS for Advanced Packaging Applications)

Another interesting paper will be presented by China's Institute of Computing Technology, describing a new version of the China-made Godson 3B processor. The 8-core processor is a 32-nm high-K, metal gate part delivering 172.8 Gflops when running at 1.35 GHz at 40W. (Paper: Godson-3B1500: A 32nm 1.35GHz 40W 172.8GFLOPS 8-Core Processor)

Renesas will describe a 28nm High- Metal-Gate communications SoC with an 1.5GHz dual-core application processor and an LTE/HSPA+-capable baseband processor

Texas Instruments and MIT will describe a 200-MHz video decoder implementing the High-Efficiency Video Coding (HEVC) draft standard to deliver 249 Mpixels/s.

AMD, IBM and Oracle will present papers on their Jaguar (Paper: Jaguar: A Next-Generation Low-Power x86-64 Core,) zSeries (Paper: 5.5GHz System z Microprocessor and Multichip Module) and Sparc T5 processors (Paper: A 3.6GHz 16-Core SPARC SoC Processor in 28nm.)

For more information, read the ISSCC 2013 advance program


Previous
Next
AOC Goes Borderless With New 23-inch IPS Monitor        All News        Latest Firefox Integrates Facebook
AOC Goes Borderless With New 23-inch IPS Monitor     PC Parts News      Skype For Android Tablets Released

Get RSS feed Easy Print E-Mail this Message

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2015 - All rights reserved -
Privacy policy - Contact Us .