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Friday, October 26, 2012
Samsung Offers Developers The Arndale Board


Samsung has made available Arndale, a new community development board designed around its Exynos 5 Dual system-on-chip (SoC).

The Exynos 5 Dual features the implementation of both the dual-core ARM Cortex-A15 MPCore processor and the quad-core ARM Mali-T604 GPU based on 32nm High-K Metal Gate (HKMG) process technology. Priced at $249.00, the newest board offers the open source developer community an environment for producing mobile applications, including in the areas of gaming, security, multimedia and user interface on multiple operating systems.

"The latest community development board powered by the Exynos 5 Dual gives developers access to a complete dual-core Cortex-A15 processor and Mali-T604 GPU platform with features not usually found on other community platforms, including NFC, GPS and a camera sensor," stated TH Kim, vice president of System LSI marketing, Device Solutions, Samsung Electronics.



Samsung's Exynos 5 Dual processor leads the way in GPU compute as the first SoC capable of full profile OpenCL. It also incorporates the latest in security and multimedia technologies to meet the needs of the next generation of mobile products. The initial version of the Arndale board will ship with the Android Jellybean OS.

The Arndale community board is available for pre-order today. Further details available on www.arndaleboard.org.

Samsung Exynos 5 Dual Arndale Board

- CPU Board

Cortex-A15@1.7 GHz dual core subsystem with 64/128 bit SIMD NEON
32KB(instruction)/32KB(DATA)L1 Cache and 1MB l2 Cache
32-bit 800 MHz LPDDR3/LPDDR2 2GB

- Base Board

ITU 601 camera Interface
HDMI 1.4 interfaces with on-chip PHY
One channel eDP output Single WQXGA
MIPI DSI Standard Specification V1.01r11
MIPI CSI Standard Specification V1.0 Two ports
USB3.0 Host or Device 1-channel that supports SS(5Gbps) with on-chip PHY
USB2.0 Host or Device 1-channel that supports LS/FS/HS with on-chip PHY
USB HSIC 2-channel that supports 480Mbps with on-chip PHY
SATA 1.0/2.0/3.0 interface
One channel eMMC 4.5 & SDIO 3.0
Two channel SD 2.0
Four channel high-speed UART
(up to 3Mbps data rate for Bluetooth 2.0 EDR and IrDA 1.0SIR)
Three channel high-speed SPI
Three channel 24-bit I2S audio interface
Four channel I2C interface support , up to 400kbps
Four channel HS-I2C up to 3.1Mps


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