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Monday, September 17, 2012
Hitachi Chemical and Institute of Microelectronics to Develop 3D IC Packaging Material Technologies


Hitachi Chemical and A*STAR's Institute of Microelectronics (IME) in Singapore will be collaborating on a joint research of high performance material technologies to support thin wafer processing for 3 dimensional integrated circuit (3D IC) packaging.

Through this research collaboration, Hitachi Chemical will leverage IME's 3D IC process capabilities to enhance material technologies that can support the requirements of thin wafer processing and enable the industry to move to high-volume production of 3D ICs. This research will improve productivity of 3D ICs, to be used in mobile handsets, computers, gaming platforms, wireless and wired communication equipment, cameras, automobiles and aerospace applications.

"IME has strong background technologies of microelectronics, especially in IC packaging technologies, and Hitachi Chemical has many kinds of material for the electronics. I believe this joint research between IME and Hitachi Chemical will contribute greatly to the progress in advanced 3D IC packaging technologies." said Shun-ichiro Uchimura, Vice President and CTO of Hitachi Chemical.

"Our expertise, experience and infrastructure in 2.5D/3D IC process-integration, thin wafer-handling, and assembly flow provide a compelling value proposition for advanced materials manufacturers to test their products and overcome key technical barriers in the commercialization of 2.5D/3D IC technology," said Prof. Dim-Lee Kwong, Executive Director of IME. "IME is in a strong position to enable materials development that is increasingly critical to ramping advanced packaging technologies to high volume manufacturing."


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