Saturday, January 31, 2015
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
ASUS Announces The B85M-Gamer Mainboard
AT&T, Verizon Among Winners Of US Airwaves Auction
Apple Closes the Gap on Samsung Fourth Quarter's Worldwide Smartphone Shipments
Verizon To Let USers Opt Out Supercookies
Microsoft Outlines Windows 10 Options For The Enterprise
Jolla Tablet Returns to Indiegogo With A 64GB Version
BT Sees Ultrafast Broadband Not Coming Earlier Than 2025
Google To Change Privacy Policy After UK's Watchdog Investigation
Active Discussions
Why Double Logins ?
retrieving burned cd information
Writing Audio files on DVDs ?
Need major help with Gigabeat
New match-3 puzzle game launch now!
Rimage 2000i
Sound card for my Laptop
hello
 Home > News > General Computing > TSMC To...
Last 7 Days News : SU MO TU WE TH FR SA All News

Wednesday, September 05, 2012
TSMC To Delay Transition To 450-mm Wafers


Taiwan Semiconductor Manufacturing Co. (TSMC) will start using 450-millimeter wafers to build its processors in 2018, following delays in the development of the new technology.

J.K. Wang, Taiwan Semiconductor Manufacturing Co.?s vice president for operations/300mm fabs, said the company will begin volume production of chips on 450mm silicon wafers in 2018, offering FinFET transistor technology at 10nm node. He noted that TSMC has completed its planning for deploying 450mm wafer production.

The company's vice president for research and development, Burn Lin, pointed out that TSMC will begin volume production of FinFET transistors at 20nm process and is on the track to deploy 16nm FinFET process. In addition to ultraviolet lithography, Lin said that TSMC is also considering multi e-beam lithography technology for its 10nm FinFET process. He pointed out that TSMC will use the legacy immersion lithography technology on its 10nm and 16nm transistors as EUV is still immature. However, transistors smaller than 10nm will use next-generation lithography technology.

Intel, TSMC, Samsung, IBM, and GlobalFoundry have formed an alliance to push for 450mm technology.

Currently, chip makers are using silicon wafers at the 300-mm size to build their processors. Upgrading to the 450-mm level would allow companies to produce more chips from each wafer, as the 450-mm wafers have 2.5 times more surface area.

Industry has been slow to move forward to 450-mm wafer manufacturing, as billions of dollars are needed to invest in building the tools and factories to produce the wafers.


Previous
Next
Singulus Sees Growth Oportunities Despite Slow Economy        All News        Intel To Present 4th Gen "Haswell" Chips at IDF
Lenovo Buys CCE     General Computing News      Windows Server 2012 Released

Get RSS feed Easy Print E-Mail this Message

Related News
TSMC Selling Sold ASML Stake
TSMC Sells LED Unit to Epistar
TSMC Chairman Sees Technical Hurdles In keeping Up With Moore's Law
TSMC To Make Intel's SoFIA Handset Chips
TSMC 16FinFET Plus Process Achieves Risk Production Milestone
TSMC Said To Make New iPad Processor
ARM and TSMC Unveil Roadmap for 64-bit ARM-based Processors on 10FinFET Process
TSMC and ARM Announce 16nm FinFET Silicon with 64-bit ARM big.LITTLE Technology
TSMC Launches Ultra-Low Power Technology Platform for IoT and Wearable Devices
TSMC Delivers First 16FinFET Networking Processor
TSMC Acquires EUV Machines For 10nm Chips
TSMC 28HPC Process Enters Volume Production

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2015 - All rights reserved -
Privacy policy - Contact Us .