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Monday, May 21, 2012
AMD Launches R-Series APU Platform For Embedded Applications

AMD today launched the AMD Embedded R-Series accelerated processing unit (APU) platform, designed for for mid- to high-end graphics-intensive applications such as digital signage, point-of-sale systems and kiosks.

The platform features dual or quad-core x86 processors, integrated x86 graphics cores (AMD Radeon HD 7000G Series), a unified North Bridge chip and an integrated DDR3 memory controller (64-bit DDR3 SDRAM controllers operating at up to 1600 MT/s - 800 MHz).

The AMD Embedded R-Series APU combines AMD's new "Piledriver" CPU architecture with discrete-class, DirectX 11-capable AMD Radeon HD 7000 Series graphics in a heterogeneous multicore embedded processing platform.

The AMD Embedded R-Series APU integrates dedicated resources that enable performance with shared resources to help reduce power consumption and die space. Developers working with the AMD Embedded R-Series APU can implement remote management, client virtualization and security capabilities through AMD DAS 1.0 featuring DASH 1.1, AMD Virtualization and Trusted Platform Module (TPM) 1.2 support.

Multimedia enhancements available for the AMD Embedded R-Series APU include a a video compression engine that provides a dedicated hardware encoder, a Secure Asset Management unit that allows for GPU-assisted encryption/decryption of content along with enhancements to the Unified Video Decoder that extend the capabilities of the platform to include dual, high-definition decode and stereoscopic 3D.

For applications that benefit from multiple displays, the AMD Embedded R-Series APU supports connection to four independent displays, which can be utilized to display four independent video feeds or a single video feed distributed across a four-panel display. By adding a discrete AMD Radeon Embedded graphics card to the system, the number of independent displays can increase up to 10.

AMD is offering the APU FS1r2 (722-pin lidless μ PGA, 35mm x 35mm, 1.2192-mm pin pitch) and the FP2 (827-ball lidless μ BGA, 27mm x 31mm, 0.8mm to 1.2-mm ) packages. These include both quad-core and dual-core APUs clocked at up to 3.2GHz (TURBO), an 128 Bit memory interface organized as two 64 bit channels ( DDR3 1.5V, LVDDR3 1.35V, ULVDDR3 1.25V up to DDR3-1600) and AMD Radeon HD7000G graphics clocked at up to 686MHz (Radeon HD 7660G). APU TDP is ranging from 17 to 35 Watts and average power below 13 Watts.

These platform versions are coupled with the A70M and A75 controller hubs (USB, PCI-E, SATA, audio etc).

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